X-On Electronics has gained recognition as a prominent supplier of WAVE-40-125 Heat Sinks across the USA, India, Europe, Australia, and various other global locations. WAVE-40-125 Heat Sinks are a product manufactured by Wakefield. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.

WAVE-40-125 Wakefield

WAVE-40-125 electronic component of Wakefield
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Part No.WAVE-40-125
Manufacturer: Wakefield
Category: Heat Sinks
Description: Heat Sinks Wave Series Low Profile Heatsink BGA Chipset Aluminum Top Mount, 40x40x12.5mm
Datasheet: WAVE-40-125 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
5: USD 6.2081 ea
Line Total: USD 31.04 
Availability - 97
Ship by Thu. 28 Nov to Wed. 04 Dec
MOQ: 5  Multiples: 5
Pack Size: 5
Availability Price Quantity
97
Ship by Thu. 28 Nov to Wed. 04 Dec
MOQ : 5
Multiples : 5
5 : USD 6.2081
50 : USD 5.04
100 : USD 4.9744
250 : USD 4.6856
500 : USD 4.4231
1000 : USD 4.3575
3000 : USD 4.1869
5000 : USD 4.1344

   
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We are delighted to provide the WAVE-40-125 from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the WAVE-40-125 and other electronic components in the Heat Sinks category and beyond.

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Wave Series Heat Sink with Integrated Clip Assembly BGA Heat Sinks The Wakefield-Vette Wave Series Heat Sink Series are a superior choice for cooling BGA applications in which limited height/footprint while achieving maximum surface area. The Wave Series Heat Sinks include a unique clipping mechanism that allows for superior heat transfer while securing the heat sink to the BGA itself. The clipping mechanism allows for easy installation in high production assembly. Features & Benefits Approximately 12% better thermal performance than traditional footprint heat sinks Height- A low profile design allows for more surface area in a height restricted application Clipping mechanism included with heat sink Surface Area- Fin array allows for more surface area for forced convection Easily customizable Easily compatible with major BGA device manufacturers components such as: Broadcomm, Motorola, Freescale, TI, Intel, etc. Material Specifications Heat Sink: Aluminum Alloy 6063-T5 with black anodized finish. Spring Clip: 304 Stainless Steel, 1.2mm 0.47 DIA RoHS Compliant Mechanical Dimensions (mm) Thermal Resistance - WkV Part Attachment Fin Surface Area Height Off Base Forced Conv. Number Description Method Length Width Width Height (sq mm) (Fin Height) 200 LFM WAVE-23-125 Spring-Anchor 23 23 40 12.5 6055.1 10.5 6.76 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-23-165 Spring-Anchor 23 23 46.5 16.5 7634.6 14.5 5.08 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-26-12 Spring-Anchor 26 26 52.9 12 8305.2 10 5.21 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-29-127 Wave Heat Sink BGA Chipset Aluminum Top Mount Spring-Anchor 29 29 61.4 12.7 11810.5 10.7 4.08 WAVE-32-12 Wave Heat Sink BGA Chipset Aluminum Top Mount Spring-Anchor 32 32 50.2 12 10957.5 10 4.64 WAVE-34-21 Spring-Anchor 34 34 70 21 21268.4 19 2.19 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-35-12 Spring-Anchor 35 35 62 12 15180.8 10 3.83 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-35-125 Spring-Anchor 35 35 63.3 12.5 15792.6 10.5 3.63 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-35-15 Wave Heat Sink BGA Chipset Aluminum Top Mount Spring-Anchor 35 35 58.1 15 15612.7 13 3.15 WAVE-35-21 Wave Heat Sink BGA Chipset Aluminum Top Mount Spring-Anchor 35 35 74.6 21 21721.8 19 2.11 WAVE-366-175 Spring-Anchor 36.6 36.6 63.6 17.5 18637.8 15.5 2.55 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-40-12 Spring-Anchor 40 40 66.9 12 17689.4 10 3.36 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-40-125 Spring-Anchor 40 40 68.3 12.5 18410.1 10.5 3.16 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-425-117 Wave Heat Sink BGA Chipset Aluminum Top Mount Spring-Anchor 42.5 42.5 67.4 11.7 21668.3 9.3 3.40 WAVE-45-12 Wave Heat Sink BGA Chipset Aluminum Top Mount Spring-Anchor 45 45 72 12 22303.7 10 2.96Wave Series Heat Sink with Integrated Clip Assembly BGA Heat Sinks Wave 2x Series Mechanical Dimensions (mm) Thermal Resistance - WkV Part Attachment Fin Surface Area Height Off Base Forced Conv. Number Description Method Length Width Width Height (sq mm) (Fin Height) 200 LFM WAVE-23-125 Wave Heat Sink BGA Chipset Aluminum Top Mount Spring-Anchor 23 23 40 12.5 6055.1 10.5 6.76 WAVE-23-165 Wave Heat Sink BGA Chipset Aluminum Top Mount Spring-Anchor 23 23 46.5 16.5 7634.6 14.5 5.08 WAVE-26-12 Spring-Anchor 26 26 52.9 12 8305.2 10 5.21 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-29-127 Spring-Anchor 29 29 61.4 12.7 11810.5 10.7 4.08 Wave Heat Sink BGA Chipset Aluminum Top Mount WAVE-23-125 WAVE-23-165

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
Wakefield Engineering
WAKEFIELD SOLUTIONS
WAKEFIELD THERMAL
Wakefield Thermal Solutions
Wakefield Thermal Solutions, Inc.
Wakefield-Vette
Wakefield-Vette, Inc
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