X-On Electronics has gained recognition as a prominent supplier of W25M161AVEIT Multichip Packages across the USA, India, Europe, Australia, and various other global locations. W25M161AVEIT Multichip Packages are a product manufactured by Winbond. We provide cost-effective solutions for Multichip Packages, ensuring timely deliveries around the world.

W25M161AVEIT Winbond

W25M161AVEIT electronic component of Winbond
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Part No.W25M161AVEIT
Manufacturer: Winbond
Category: Multichip Packages
Description: Multichip Packages 1Gb Serial NAND flash 3V + 16Mb Serial Flash 3V MCP
Datasheet: W25M161AVEIT Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 0.1608 ea
Line Total: USD 0.16 
Availability - 3790
Ship by Thu. 28 Nov to Wed. 04 Dec
MOQ: 1  Multiples: 1
Pack Size: 1

 W25M161AVEIT More Buying Options & Price Grid(s)

Availability Price Quantity
3790
Ship by Thu. 28 Nov to Wed. 04 Dec
MOQ : 1
Multiples : 1
1 : USD 0.1608

Specifications

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Type
Memory Size
Package / Case
Series
Mounting Style
Maximum Clock Frequency
Minimum Operating Temperature
Maximum Operating Temperature
Organization
Packaging
Brand
Interface Type
Data Bus Width
Product Type
Factory Pack Quantity :
Subcategory
Supply Voltage - Max
Supply Voltage - Min
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We are delighted to provide the W25M161AVEIT from our Multichip Packages category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25M161AVEIT and other electronic components in the Multichip Packages category and beyond.

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Additional Infomation About Product

W25M161AV Featuring SERIAL MCP FLASH MEMORY With Multi I/O SPI & Concurrent Operations 3V 16M-bit Serial NOR Flash Memory & 3V 1G-bit Serial NAND Flash Memory Publication Release Date: August 24, 2016 Preliminary Revision A W25M161AV Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 2 2. FEATURES ....................................................................................................................................... 3 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 4 3.1 Pad Configuration WSON 8x6-mm ...................................................................................... 4 3.2 Pad Description WSON 8x6-mm .......................................................................................... 4 4. DEVICE CONFIGURATION & PIN DESCRIPTIONS ....................................................................... 5 4.1 Serial MCP (SpiStack ) Device Configuration ..................................................................... 5 4.2 Chip Select (/CS) .................................................................................................................. 5 4.3 Serial Input & Output (DI, DO and IO0, IO1, IO2, IO3) ........................................................ 5 4.4 Serial Clock (CLK) ................................................................................................................ 6 5. CONCURRENT OPERATION DESCRIPTIONS .............................................................................. 6 6. SOFTWARE DIE SELECT (C2H) INSTRUCTION ........................................................................... 7 7. SOFTWARE RESET......................................................................................................................... 8 7.1.1 Enable Reset (66h) and Reset Device (99h) .......................................................................... 9 7.1.2 Device Reset (FFh) ................................................................................................................. 9 8. PACKAGE SPECIFICATIONS ....................................................................................................... 10 8.1 8-Pad WSON 8x6-mm (Package Code E) ......................................................................... 10 9. ORDERING INFORMATION .......................................................................................................... 11 9.1 Valid Part Numbers and Top Side Marking ........................................................................ 12 10. REVISION HISTORY ...................................................................................................................... 13 - 1 -

HS Compliance

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory

Winbond Elec may also be referenced as

WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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