X-On Electronics has gained recognition as a prominent supplier of W25Q10EWSNIG NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25Q10EWSNIG NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

W25Q10EWSNIG Winbond

W25Q10EWSNIG electronic component of Winbond
W25Q10EWSNIG Winbond
W25Q10EWSNIG NOR Flash
W25Q10EWSNIG  Semiconductors

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See Product Specifications
Part No. W25Q10EWSNIG
Manufacturer: Winbond
Category: NOR Flash
Description: Flash Serial (SPI, Dual SPI, Quad SPI) 1.8V 1M-bit 8-bit 6ns 8-Pin SOIC Tube
Datasheet: W25Q10EWSNIG Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0
MOQ : 100
Multiples : 1
100 : USD 0.3596
N/A

Obsolete
0
MOQ : 1700
Multiples : 1700
1700 : USD 0.3622
5100 : USD 0.3461
10200 : USD 0.3424
25500 : USD 0.3387
N/A

Obsolete
   
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We are delighted to provide the W25Q10EWSNIG from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25Q10EWSNIG and other electronic components in the NOR Flash category and beyond.

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W25Q10EW 1.8V 1M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS, DUAL AND QUAD SPI Publication Release Date: December 06, 2017 - 1 - Revision I W25Q10EW Table of Contents 1. GENERAL DESCRIPTION ......................................................................................................... 5 2. FEATURES ................................................................................................................................. 5 4. PACKAGE TYPES AND PIN CONFIGURATIONS..................................................................... 6 4.1 Pin Configuration SOIC/VSOP 150-mil .......................................................................... 6 4.2 PAD Configuration USON 2x3-mm................................................................................. 6 4.3 Pin Description SOIC /VSOP 150-mil and USON 2x3-mm ............................................ 6 4.4 Ball Configuration WLCSP .............................................................................................. 7 4.5 Ball Description WLCSP ................................................................................................. 7 5. PIN DESCRIPTIONS .................................................................................................................. 8 5.1 Chip Select (/CS) ............................................................................................................ 8 5.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ............................... 8 5.3 Write Protect (/WP) ......................................................................................................... 8 5.4 HOLD (/HOLD)................................................................................................................ 8 5.5 Serial Clock (CLK) .......................................................................................................... 8 6. BLOCK DIAGRAM ...................................................................................................................... 9 7. FUNCTIONAL DESCRIPTION.................................................................................................. 10 7.1 SPI OPERATIONS ....................................................................................................... 10 7.1.1 Standard SPI Instructions ............................................................................................... 10 7.1.2 Dual SPI Instructions ...................................................................................................... 10 7.1.3 Quad SPI Instructions ..................................................................................................... 10 7.1.4 Hold Function .................................................................................................................. 10 7.2 WRITE PROTECTION .................................................................................................. 11 7.2.1 Write Protect Features .................................................................................................... 11 8. CONTROL AND STATUS REGISTERS ................................................................................... 12 8.1 STATUS REGISTER .................................................................................................... 12 8.1.1 BUSY .............................................................................................................................. 12 8.1.2 Write Enable Latch (WEL) .............................................................................................. 12 8.1.3 Block Protect Bits (BP2, BP1, BP0) ................................................................................ 12 8.1.4 Top/Bottom Block Protect (TB) ....................................................................................... 12 8.1.5 Sector/Block Protect (SEC) ............................................................................................. 12 8.1.6 Complement Protect (CMP) ............................................................................................ 12 8.1.7 Protection and Special One time Programming Setting(SRP and SRL) ......................... 13 8.1.8 Erase/Program Suspend Status (SUS) ........................................................................... 14 8.1.9 Security Register Lock Bits (LB 3:1 ) Volatile/Non-Volatile OTP Writable ................. 14 8.1.10 Quad Enable (QE) ........................................................................................................ 14 8.1.11 Status Register Memory Protection (CMP = 0) ............................................................. 15 8.1.12 Status Register Memory Protection (CMP = 1) ............................................................. 16 8.2 INSTRUCTIONS ........................................................................................................... 17 8.2.1 Manufacturer and Device Identification ........................................................................... 17 (1) 8.2.2 Instruction Set Table 1 (Erase, Program Instructions) ................................................. 18 8.2.3 Instruction Set Table 2 .................................................................................................... 18 8.2.4 Write Enable (06h) .......................................................................................................... 20 8.2.5 Write Enable for Volatile Status Register (50h) ............................................................... 21 Publication Release Date: December 06, 2017 - 2 - Revision I

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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