X-On Electronics has gained recognition as a prominent supplier of W25Q80DLSNIG NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25Q80DLSNIG NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

W25Q80DLSNIG Winbond

W25Q80DLSNIG electronic component of Winbond
W25Q80DLSNIG Winbond
W25Q80DLSNIG NOR Flash
W25Q80DLSNIG  Semiconductors

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See Product Specifications
Part No. W25Q80DLSNIG
Manufacturer: Winbond
Category: NOR Flash
Description: NOR Flash spiFlash, 8M-bit, 4Kb Uniform Sector
Datasheet: W25Q80DLSNIG Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0
MOQ : 100
Multiples : 1
100 : USD 0.4418
250 : USD 0.4373
500 : USD 0.433
1000 : USD 0.4288
2000 : USD 0.4244
2500 : USD 0.4202
3000 : USD 0.416
5000 : USD 0.4119
10000 : USD 0.4077
N/A

Obsolete
0
MOQ : 1
Multiples : 1
1 : USD 0.5062
10 : USD 0.4969
100 : USD 0.4186
500 : USD 0.4139
1000 : USD 0.3823
2800 : USD 0.3672
11200 : USD 0.3472
25200 : USD 0.3403
50400 : USD 0.3344
N/A

Obsolete
   
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We are delighted to provide the W25Q80DLSNIG from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25Q80DLSNIG and other electronic components in the NOR Flash category and beyond.

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W25Q80DV/DL 2.5V AND 3V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI Publication Release Date:October 02, 2015 - 1 - Preli mry-Revision H W25Q80DV/DL Table of Contents 1. GENERAL DESCRIPTION ......................................................................................................... 5 2. FEATURES ................................................................................................................................. 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS..................................................................... 6 3.1 Pin Configuration SOIC 150-MIL/208-mil AND VSOP 150-mil: ...................................... 6 3.2 Pad Configuration WSON 6x5-mm, USON 2X3-mm...................................................... 6 3.3 Pin Configuration PDIP 300-mil ...................................................................................... 7 3.4 Pin Description SOIC/VSOP , WSON/USON & PDIP 300-mil ....................................... 7 3.5 Ball Configuration WLCSP .............................................................................................. 8 3.6 Ball Description WLCSP ................................................................................................. 8 4. PIN DESCRIPTIONS .................................................................................................................. 9 4.1 Chip Select (/CS) ............................................................................................................ 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ............................... 9 4.3 Write Protect (/WP) ......................................................................................................... 9 4.4 HOLD (/HOLD)................................................................................................................ 9 4.5 Serial Clock (CLK) .......................................................................................................... 9 5. BLOCK DIAGRAM .................................................................................................................... 10 6. FUNCTIONAL DESCRIPTION.................................................................................................. 11 6.1 SPI OPERATIONS ....................................................................................................... 11 6.1.1 Standard SPI Instructions ............................................................................................... 11 6.1.2 Dual SPI Instructions ...................................................................................................... 11 6.1.3 Quad SPI Instructions ..................................................................................................... 11 6.1.4 Hold Function .................................................................................................................. 11 6.2 WRITE PROTECTION .................................................................................................. 12 6.2.1 Write Protect Features .................................................................................................... 12 7. CONTROL AND STATUS REGISTERS ................................................................................... 13 7.1 STATUS REGISTER .................................................................................................... 13 7.1.1 BUSY .............................................................................................................................. 13 7.1.2 Write Enable Latch (WEL) .............................................................................................. 13 7.1.3 Block Protect Bits (BP2, BP1, BP0) ................................................................................ 13 7.1.4 Top/Bottom Block Protect (TB) ....................................................................................... 13 7.1.5 Sector/Block Protect (SEC) ............................................................................................. 13 7.1.6 Complement Protect (CMP) ............................................................................................ 14 7.1.7 Status Register Protect (SRP1, SRP0) ........................................................................... 14 7.1.8 Erase/Program Suspend Status (SUS) ........................................................................... 14 7.1.9 Security Register Lock Bits (LB3, LB2, LB1) ................................................................... 14 7.1.10 Quad Enable (QE) ........................................................................................................ 15 7.1.11 Status Register Memory Protection (CMP = 0) ............................................................. 16 7.1.12 Status Register Memory Protection (CMP = 1) ............................................................. 17 8. INSTRUCTIONS ....................................................................................................................... 18 8.1 Manufacturer and Device Identification ........................................................................ 18 (1) 8.2 Instruction Set Table 1 (Standard SPI Instructions) .................................................. 19 8.3 Instruction Set Table 2 (Dual SPI Instructions) ............................................................. 20 8.4 Instruction Set Table 3 (Quad SPI Instructions) ........................................................... 20 8.5 Instruction Descriptions ................................................................................................ 22 Publication Release Date:October 02, 2015 - 2 - Preli mry-Revision H

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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