260-4.7M-RC Xicon

5% Thick Film Chip Resistors (RoHS Compliant) CR5-RC Series FEATURES Temperature Range: -55C ~ +125C High purity alumina substrate Wave or flow solderable Excellent high frequency characteristics Wrap around termination Inner electrode protection Value range 0 ~ 10M DERATING CURVE REEL DIMENSIONS (mm) Primary Encapsulant Secondary Resistor 13 0.5 Encapsulant 50 178 min. 2.0 Alumina Primary Electrode Secondary Electrode 10 1 Ni-Plating Sn-Plating Ambient Temperature ( C) PART NUMBERING SYSTEM - 2 6 0 1 0 K - R C Series Value Suffix (RoHS Compliant) SERIES, SIZE, WATTAGE, VOLTAGE, AND DIMENSIONS C t Voltage (V) (max.) Dimensions (mm) Watts Series Case Size D W.V. O.V. L W C D t L 301 0603 1/10 50 100 1.60 .10 0.8 .15 0.3 .20 0.30 .20 .45 .10 260 0805 1/8 150 300 2.0 0.15 1.25 .15 0.4 0.2 0.4 0.2 .55 .10 W 263 1206 1/4 200 400 3.1 0.15 1.55 .15 0.45 0.2 0.45 0.2 .55 .10 STANDARD STOCKED VALUES () 0 2.0 4.3 9.1 20 43 91 200 430 910 2K 4.3K 9.1K 20K 43K 91K 200K 430K 820K 1.8M 3.9M 8.2M 1.0 2.2 4.7 10 22 47 100 220 470 1K 2.2K 4.7K 10K 22K 47K 100K 220K 470K 910K 2M 4.3M 9.1M 1.1 2.4 5.1 11 24 51 110 240 510 1.1K 2.4K 5.1K 11K 24K 51K 110K 240K 510K 1M 2.2M 4.7M 10M 1.2 2.7 5.6 12 27 56 120 270 560 1.2K 2.7K 5.6K 12K 27K 56K 120K 270K 560K 1.1M 2.4M 5.1M 1.3 3.0 6.2 13 30 62 130 300 620 1.3K 3K 6.2K 13K 30K 62K 130K 300K 620K 1.2M 2.7M 5.6M 1.5 3.3 6.8 15 33 68 150 330 680 1.5K 3.3K 6.8K 15K 33K 68K 150K 330K 660K 1.3M 3M 6.2M 1.6 3.6 7.5 16 36 75 160 360 750 1.6K 3.6K 7.5K 16K 36K 75K 160K 360K 680K 1.5M 3.3M 6.8M 1.8 3.9 8.2 18 39 82 180 390 820 1.8K 3.9K 8.2K 18K 39K 82K 180K 390K 750K 1.6M 3.6M 7.5M NOTE: RoHS Compliant by Exemption CONSTRUCTION 1 No. Part Name 1 Protective coating: Epoxy 2 Al2O3 high purity alumina substrate: Al 96 3 Resistive element: metal film 4 4 Termination (Inner): Ag/Pd 5 Termination (Between): Ni plating film 2 34 5 6 Termination (Outer): Sn plating film XICON PASSIVE COMPONENTS (800) 628-0544 Date Revised: 9/06/19 XC-600033 Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation. Rated Load (%)5% Thick Film Chip Resistors (RoHS Compliant) CR5-RC Series CHARACTERISTICS Characteristics Limits Test Methods ( JIS C 5201-1 ) 5.2 Natural resistance change per temp. degree centigrade. Temperature 1 ~ 10 400 PPM / C R2-R1 6 coefficient 11 ~ 10M 200 PPM / C x10 (PPM/C) R1(t2-t1) R1: Resistance value at room temperature (t1) R2: Resistance value at room temp.plus 100C (t2) Short time Resistance change rate is 5.5 Permanent resistance change after the overload (2.0 % + 0.1) Max. application of a potential of 2.5 times RCWV for 5 seconds. Insulation 1,000M or more 5.6 Apply 500V DC between protective coating resistance and termination for 1 minute Dielectric No evidence of flashover 5.7 Apply 500V AC between protective coating withstanding mechanical damage,arcing or and termination for 1 minute voltage insulation break down. Terminal bending (1.0% +0.05) Max. 6.1.4 Twist of Test Board: Y/X=5/90mm for 10 seconds 7.4 Resistance change after continuous 5 cycles for duty shown below: Temperature (1.0% + 0.05) Max. Step Temperature Time cycling 1 -55C 3C 30 mins 2 Room temp. 10~15 mins 3 +155C 2C 30 mins 4 Room temp. 10~15 mins 7.9 Resistance change after 1,000 hours Load life in Resistance change rate is (1.5 hourso, 0.5 hourof) at RCWV humidity (3.0% + 0.1) Max. in a humidity chamber controlled at 40C 2C and 90 to 95 % relative humidity Load life Resistance change rate is 7.10 Permanent resistance change after 1,000 hours (3.0% + 0.1) Max. operating at RCWV, with duty cycle of ( 1.5 hourso, 0.5 hourof ) at 70C 2C ambient Soldering Heat Electrical characteristics shall be satisfied. Solder bath method Without distinct deformation in Pre-Heat: 100 to 105C, 30 5 sec. appearance. Temperature: 265 3C, 5 +1/-0 sec Reflow soldering method Peak: 250 +5/-0C 230C or higher, 30 10Sec. Solder iron method Bit temperature: 350 10C Application time of soldering iron: 3 +1/-0 seconds Solderability 95% Coverage min. 6.5 Test temperature of solder: 245 3C Dipping them solder: 2~3 seconds XICON PASSIVE COMPONENTS (800) 628-0544 XC-600033 Date Revised: 9/06/19 Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.