PC852 Sharp

PC852XJ0000F Series/PC853XJ0000F Series DIP 4pin Darlington Phototransistor Ouput, PC852XJ0000F High Collector-emitter Voltage Photocoupler Series PC853XJ0000F Series Description Agency approvals/Compliance PC852XJ0000F Series/PC853XJ0000F Series con- 1. Recognized by UL1577, file No. E64380 (as model tains an IRED optically coupled to a phototransistor. No. PC852/PC853) ( ) It is packaged in a 4-pin DIP, available in SMT gullw- 2. Approved by VDE, DIN EN60747-5-2 (only for ing lead-form option. PC852XJ0000F series as an option), file No. Input-output isolation voltage(rms) is 5.0kV. 40008087 (as model No. PC852) Collector-emitter voltage is 350V and CTR is MIN. 3. Package resin : UL flammability grade (94V-0) 1 000% at input current of 1mA. ( ) DIN EN60747-5-2 : successor standard of DIN VDE0884 Features Applications 1. 4pin DIP package 1. Telephone line interface/isolation 2. Double transfer mold package (Ideal for Flow Solder- 2. Interface to power supply circuit ing) 3. Controller for SSRs, DC motors 3. High collector-emitter voltage (V : 350V) CEO 4. Durlington phototransistor output (CTR : MIN. 1 000% at I =1mA, V =2V) F CE 5. Large collector power disspation : PC853XJ0000F (P : 300mW) C 6. High isolation voltage between input and output (V : 5kV) iso(rms) 7. Lead-free and RoHS directive compliant Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Sheet No.: D2-A04002EN 1 Date Jun. 30. 2005 SHARP CorporationPC852XJ0000F Series/PC853XJ0000F Series Internal Connection Diagram 1 Anode 1 4 3 Cathode 4 Emitter 2 3 5 Collector (Unit : mm) Outline Dimensions PC852XJ0000F Series 1. Through-Hole [ex. PC852XJ0000F] 2. Through-Hole (VDE option) [ex. PC852XYJ000F] Anode mark Factory identification mark Anode mark Factory identification mark Date code Date code 4 1 4 1 PC852 2 3 PC852 2 3 4 0.5 6.5 0.5 6.5 SHARP mark VDE identification mark 0.3 0.5 7.62 4.58 0.3 0.5 7.62 4.58 Epoxy resin Epoxy resin 0.1 0.1 0.1 0.1 0.26 0.5 0.26 0.5 : 0 to 13 : 0 to 13 Product mass : approx. 0.23g Product mass : approx. 0.23g 3. SMT Gullwing Lead-Form [ex. PC852XIJ000F] 4. SMT Gullwing Lead-Form (VDE option) [ex. PC852XPYJ00F] Anode mark Factory identification mark Anode mark Factory identification mark Date code Date code 1 4 1 4 2 3 PC852 3 2 PC852 4 0.5 6.5 0.5 6.5 SHARP mark VDE identification mark 0.3 0.5 7.62 4.58 0.3 0.5 7.62 4.58 Epoxy resin +0.4 +0.4 1.0 1.00 0 Epoxy resin +0.4 +0.4 1.0 +0 0.25 1.0 0 0 10.0 0.5 2.54 +0 0.25 10.0 2.54 0.5 Product mass : approx. 0.22g Product mass : approx. 0.22g Plating material : SnCu (Cu : TYP. 2%) Sheet No.: D2-A04002EN 2 0.3 1.2 0.3 1.2 0.1 0.2 0.26 0.6 0.2 0.6 0.25 2.54 0.25 0.25 0.35 2.54 0.5 4.58 0.5 0.3 2.7 4.58 0.5 0.5 3.0 3.5 TYP. 0.5 0.5 3.5 0.3 1.2 0.3 1.2 0.1 0.2 0.26 0.6 0.2 0.6 0.25 2.54 0.25 0.25 0.35 0.5 2.54 4.58 0.5 2.7 0.3 4.58 0.5 0.5 3.0 3.5 TYP. 0.5 0.5 3.5