X-On Electronics has gained recognition as a prominent supplier of AS4C128M8D3-12BIN DRAM across the USA, India, Europe, Australia, and various other global locations. AS4C128M8D3-12BIN DRAM are a product manufactured by Alliance Memory. We provide cost-effective solutions for DRAM, ensuring timely deliveries around the world.

AS4C128M8D3-12BIN Alliance Memory

AS4C128M8D3-12BIN electronic component of Alliance Memory
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Part No.AS4C128M8D3-12BIN
Manufacturer: Alliance Memory
Category: DRAM
Description: DRAM 1G, 1.5V, 1600Mhz 128M x 8 DDR3
Datasheet: AS4C128M8D3-12BIN Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 5.489 ea
Line Total: USD 5.49 
Availability - 155
Ship by Fri. 27 Dec to Tue. 31 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
155
Ship by Fri. 27 Dec to Tue. 31 Dec
MOQ : 1
Multiples : 1
1 : USD 5.489
10 : USD 5.071
100 : USD 4.554
242 : USD 4.532
484 : USD 4.312
968 : USD 4.136
2662 : USD 4.004
5082 : USD 3.949
10164 : USD 3.85

   
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RoHS - XON
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We are delighted to provide the AS4C128M8D3-12BIN from our DRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the AS4C128M8D3-12BIN and other electronic components in the DRAM category and beyond.

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AS4C128M8D3 REVISION HISTORY Revision Description Issue Date Rev. 1.0 Initial Issue February 2014 Rev. 2.0 Typing error in Table 2 page 2 incorrect temperature range June 2014 amended to: - Commercial (Extended)(0 ~ 95C) - Industrial (-40 ~ 95C) Rev 3.0 Updated Table 12. Recommended DC Operating Conditions page August 2014 21 Added CL=5 & CL=6 to Table 18 page 26 Rev 4.0 August 2016 Update the package information Confidential 1 Rev. 4.0 Aug. /2016AS4C128M8D3 1Gb (128M x 8) bit DDR3 Synchronous DRAM (SDRAM) Confidential Advanced (Rev. 4.0, Aug. /2016) Overview Features JEDEC Standard Compliant The 1Gb Double-Data-Rate-3 DRAMs is double data rate architecture to achieve high-speed operation. It is Power supplies: V & V = +1.5V 0.075V DD DDQ internally configured as an eight bank DRAM. Operating temperature: The 1Gb chip is organized as 16Mbit x 8 I/Os x 8 bank - Commercial (Extended) (0 ~ 95C) devices. These synchronous devices achieve high - Industrial (-40 ~ 95C) speed double-data-rate transfer rates of up to 1600 Supports JEDEC clock jitter specification Mb/sec/pin for general applications. Fully synchronous operation The chip is designed to comply with all key DDR3 Fast clock rate: 800MHz DRAM key features and all of the control and address Differential Clock, CK & CK inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the Bidirectional differential data strobe cross point of differential clocks (CK rising and CK - DQS & DQS falling). All I/Os are synchronized with differential DQS 8 internal banks for concurrent operation pair in a source synchronous fashion. 8n-bit prefetch architecture These devices operate with a single 1.5V 0.075V Internal pipeline architecture power supply and are available in BGA packages. Precharge & active power down Programmable Mode & Extended Mode registers Additive Latency (AL): 0, CL-1, CL-2 Programmable Burst lengths: 4, 8 Burst type: Sequential / Interleave Output Driver Impedance Control 8192 refresh cycles / 64ms - Average refresh period 7.8s -40 TC +85 3.9s +85 TC +95 Write Leveling OCD Calibration Dynamic ODT (Rtt Nom & Rtt WR) RoHS compliant Auto Refresh and Self Refresh 78-ball 8 x 10.5 x 1.2mm FBGA package - All parts are ROHS Compliant Table 1. Speed Grade Information Speed Grade Clock Frequency CAS Latency t t (ns) (ns) RCD RP DDR3-1600 800 MHz 11 13.75 13.75 Table 2 Ordering Information for ROHS Compliant Products Product part No Org Temperature Package AS4C128M8D3-12BCN 128M x 8 Commercial(Extended) 78-ball FBGA 0C to 95C AS4C128M8D3-12BIN 128M x 8 Industrial 78-ball FBGA -40C to 95C Confidential 2 Rev. 4.0 Aug. /2016

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
ALLIANCE MEMORY, INC.
ALLIANCE SEMI
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