X-On Electronics has gained recognition as a prominent supplier of AS7C256A-10TCN SRAM across the USA, India, Europe, Australia, and various other global locations. AS7C256A-10TCN SRAM are a product manufactured by Alliance Memory. We provide cost-effective solutions for SRAM, ensuring timely deliveries around the world.

AS7C256A-10TCN Alliance Memory

AS7C256A-10TCN electronic component of Alliance Memory
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Part No.AS7C256A-10TCN
Manufacturer: Alliance Memory
Category: SRAM
Description: SRAM 256K, 5V, 10ns, FAST 32K x 8 Asynch SRAM
Datasheet: AS7C256A-10TCN Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 2.97 ea
Line Total: USD 2.97 
Availability - 194
Ship by Fri. 22 Nov to Tue. 26 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
451
Ship by Tue. 26 Nov to Mon. 02 Dec
MOQ : 234
Multiples : 234
234 : USD 2.275

194
Ship by Fri. 22 Nov to Tue. 26 Nov
MOQ : 1
Multiples : 1
1 : USD 2.97
10 : USD 2.431
100 : USD 2.321
468 : USD 2.266
1170 : USD 2.189
2574 : USD 2.035
10062 : USD 2.002
25038 : USD 2.002

   
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RoHS - XON
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We are delighted to provide the AS7C256A-10TCN from our SRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the AS7C256A-10TCN and other electronic components in the SRAM category and beyond.

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September 2004 AS7C256A 5V 32K X 8 CMOS SRAM (Common I/O) Features TTL-compatible, three-state I/O Pin compatible with AS7C256 28-pin JEDEC standard packages Industrial and commercial temperature options - 300 mil SOJ Organization: 32,768 words 8 bits -8 13.4 mm TSOP 1 High speed ESD protection 2000 volts - 10/12/15/20 ns address access time Latch-up current 200 mA - 5, 6, 7, 8 ns output enable access time 2.0V Data retention Very low power consumption: ACTIVE - 412.5 mW max 10 ns Very low power consumption: STANDBY - 11 mW max CMOS I/O Easy memory expansion with CE and OE inputs Logic block diagram Pin arrangement V 28-pin TSOP 1 (813.4 mm) 28-pin SOJ (300 mil) CC GND Input buffer A14 1 28 V CC A12 2 27 WE OE 1 28 A10 A11 2 CE 27 A7 3 26 A13 A9 3 I/O7 26 A0 A6 4 25 A8 A8 4 25 I/O6 I/O7 A1 A13 5 24 I/O5 A5 5 24 A9 WE 6 23 I/O4 A2 256 X 128 X 8 A4 6 23 A11 V 7 I/O3 22 CC 8 A3 A14 AS7C256A 21 GND A3 7 22 OE Array A12 9 20 I/O2 A2 8 21 A10 A4 10 19 A7 I/O1 11 A1 9 20 CE (262,144) A6 18 I/O0 A5 12 A5 17 A0 A0 10 19 I/O7 A6 16 A4 13 A1 I/O0 15 I/O0 11 18 I/O6 A3 14 A2 A7 I/O1 12 17 I/O5 16 I/O2 13 I/O4 15 GND 14 I/O3 WE Column decoder Control OE circuit CE A A A A A A A 8 9 10 11 12 13 14 Selection guide -10 -12 -15 -20 Unit Maximum address access time 10 12 15 20 ns Maximum output enable access time 5 6 7 8 ns Maximum operating current 75 70 65 60 mA Maximum CMOS standby current 2 2 2 2 mA 9/24/04 v.1.2 Alliance Semiconductor P. 1 of 9 Copyright Alliance Semiconductor. All rights reserved. Row decoder Sense amp AS7C256AAS7C256A Functional description The AS7C256A is a 5.0V high-performance CMOS 262,144-bit Static Random-Access Memory (SRAM) device organized as 32,768 words 8 bits. It is designed for memory applications requiring fast data access at low voltage, including TM TM Pentium , PowerPC , and portable computing. Alliances advanced circuit design and process techniques permit 5.0V operation without sacrificing performance or operating margins. The device enters standby mode when CE is high. CMOS standby mode consumes 11 mW. Normal operation offers 75% power reduction after initial access, resulting in significant power savings during CPU idle, suspend, and stretch mode. Equal address access and cycle times (t , t , t ) of 10/12/15/20 ns with output enable access times (t ) of 5, 6, 7, 8 ns AA RC WC OE are ideal for high-performance applications. The chip enable (CE) input permits easy memory expansion with multiple-bank memory organizations. A write cycle is accomplished by asserting chip enable (CE) and write enable (WE) LOW. Data on the input pins I/O0-I/O7 is written on the rising edge of WE (write cycle 1) or CE (write cycle 2). To avoid bus contention, external devices should drive I/O pins only after outputs have been disabled with output enable (OE) or write enable (WE). A read cycle is accomplished by asserting chip enable (CE) and output enable (OE) LOW, with write enable (WE) high. The chip drives I/O pins with the data word referenced by the input address. When chip enable or output enable is high, or write enable is low, output drivers stay in high-impedance mode. All chip inputs and outputs are TTL-compatible. Operation is from a single 5.0 0.5V supply. The AS7C256A is packaged in high volume industry standard packages. Absolute maximum ratings Parameter Symbol Min Max Unit Voltage on V relative to GND V 0.5 +7.0 V CC t1 Voltage on any pin relative to GND V 0.5 V + 0.5 V t2 CC Power dissipation P 1.0 W D o Storage temperature (plastic) T 65 +150 C stg o Ambient temperature with V applied T 55 +125 C CC bias DC current into outputs (low) I 20 mA OUT Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Truth table CE WE OE Data Mode H X X High Z Standby (I , I ) SB SB1 L H H High Z Output disable (I ) CC LHL D Read (I ) OUT CC LL X D Write (I ) IN CC Key: X = Dont care, L = Low, H = High 9/24/04 v.1.2 Alliance Semiconductor P. 2 of 9

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
ALLIANCE MEMORY, INC.
ALLIANCE SEMI
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