X-On Electronics has gained recognition as a prominent supplier of AS4C64M16D1A-6BIN DRAM across the USA, India, Europe, Australia, and various other global locations. AS4C64M16D1A-6BIN DRAM are a product manufactured by Alliance Memory. We provide cost-effective solutions for DRAM, ensuring timely deliveries around the world.

AS4C64M16D1A-6BIN Alliance Memory

AS4C64M16D1A-6BIN electronic component of Alliance Memory
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Part No.AS4C64M16D1A-6BIN
Manufacturer: Alliance Memory
Category: DRAM
Description: DRAM 1G 64Mx16 166MHz 2.5V DDR1 IT
Datasheet: AS4C64M16D1A-6BIN Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 22.825 ea
Line Total: USD 22.82 
Availability - 145
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
145
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ : 1
Multiples : 1
1 : USD 22.825
10 : USD 21.615
25 : USD 20.449
50 : USD 18.821
100 : USD 18.81
240 : USD 18.766
480 : USD 18.304
1200 : USD 18.304
2640 : USD 18.304

   
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the AS4C64M16D1A-6BIN from our DRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the AS4C64M16D1A-6BIN and other electronic components in the DRAM category and beyond.

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AS4C64M16D1A Revision History 1Gb SDRAM-AS4C64M16D1A - 66pin TSOP II / 60ball FBGA PACKAGE Revision Details Date Rev 1.0 Datasheet Oct 2015 Rev 1.1 Add FBGA package - AS4C64M16D1A-BIN Mar 2019 Alliance Memory Inc. 511 Taylor Way, San Carlos, CA 94070 TEL: (650) 610-6800 FAX: (650) 620-9211 Alliance Memory Inc. reserves the right to change products or specification without notice Confidential - 1 of 64 - Rev.1.1 Mar. 2019 AS4C64M16D1A Features Overview Fast clock rate: 166MHz The 1Gb DDR SDRAM is a high-speed CMOS double data rate synchronous DRAM containing 1024 Mbits. It is Differential Clock CK & CK internally configured as a quad 16M x 16 DRAM with a synchronous interface (all signals are registered on the Bi-directional DQS positive edge of the clock signal, CK). Data outputs occur at both rising edges of CK and . Read CK DLL enable/disable by EMRS and write accesses to the SDRAM are burst oriented accesses start at a selected location and continue for a Fully synchronous operation programmed number of locations in a programmed sequence. Accesses begin with the registration of a Internal pipeline architecture BankActivate command which is then followed by a Read or Write command. The device provides programmable Read Four internal banks, 16M x 16-bit for each bank or Write burst lengths of 2, 4, or 8. An auto precharge function may be enabled to provide a self-timed row Programmable Mode and Extended Mode precharge that is initiated at the end of the burst sequence. registers The refresh functions, either Auto or Self Refresh are easy to - CAS Latency: 2, 2.5, 3 use. In addition, 1Gb DDR features programmable DLL - Burst length: 2, 4, 8 option. By having a programmable mode register and - Burst Type: Sequential & Interleaved extended mode register, the system can choose the most suitable modes to maximize its performance. These devices Individual byte write mask control are well suited for applications requiring high memory bandwidth result in a device particularly well suited to high DM Write Latency = 0 performance main memory and graphics applications. Auto Refresh and Self Refresh 8192 refresh cycles / 64ms Precharge & active power down Power supplies: VDD & VDDQ = 2.5V 0.2V Industrial Operating Temperature: T = -40~85C A Interface: SSTL 2 I/O Interface Package: - 66 Pin TSOP II, 0.65mm pin pitch - 60 Ball FBGA - Pb and Halogen free Table 1. Ordering Information Org Temperature Max Clock (MHz) Product part No Package Commercial 0C to 85C 64 x 16 66 Pin TSOPII AS4C64M16D1A-6TCN 166MHz Industrial -40C to 85C 66 Pin TSOPII 64 x 16 AS4C64M16D1A-6TIN 166MHz Industrial -40C to 85C 60 Ball FBGA 64 x 16 AS4C64M16D1A-6BIN 166MHz Confidential - 2 of 64 - Rev.1.1 Mar. 2019

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
ALLIANCE MEMORY, INC.
ALLIANCE SEMI
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