X-On Electronics has gained recognition as a prominent supplier of ADIS16364BMLZ IMUs - Inertial Measurement Units across the USA, India, Europe, Australia, and various other global locations. ADIS16364BMLZ IMUs - Inertial Measurement Units are a product manufactured by Analog Devices. We provide cost-effective solutions for IMUs - Inertial Measurement Units, ensuring timely deliveries around the world.

ADIS16364BMLZ Analog Devices

ADIS16364BMLZ electronic component of Analog Devices
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Part No.ADIS16364BMLZ
Manufacturer: Analog Devices
Category: IMUs - Inertial Measurement Units
Description: Analog Devices IMUs - Inertial Measurement Units Hi Prec Tri-Axis Inertial Sensor
Datasheet: ADIS16364BMLZ Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 826.6 ea
Line Total: USD 826.6 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
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Ship by Thu. 28 Nov to Wed. 04 Dec
MOQ : 1
Multiples : 1
1 : USD 826.6

0
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ : 1
Multiples : 1
1 : USD 930.3646
5 : USD 873.9917
10 : USD 859.6714

   
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Six Degrees of Freedom Inertial Sensor Data Sheet ADIS16364 FEATURES GENERAL DESCRIPTION Triaxis digital gyroscope with digital range scaling The ADIS16364 iSensor is a complete inertial system that includes 75/sec, 150/sec, 300/sec settings a triaxis gyroscope and triaxis accelerometer. Each sensor in the Tight orthogonal alignment: <0.05 ADIS16364 combines industry-leading iMEMS technology with Triaxis digital accelerometer: 5 g signal conditioning that optimizes dynamic performance. The Autonomous operation and data collection factory calibration characterizes each sensor for sensitivity, bias, No external configuration commands required alignment, and linear acceleration (gyro bias). As a result, each Start-up time: 180 ms sensor has its own dynamic compensation formulas that provide Sleep mode recovery time: 4 ms accurate sensor measurements over a temperature range of Factory-calibrated sensitivity, bias, and axial alignment 20C to +70C. Calibration temperature range: 20C to +70C The ADIS16364 provides a simple, cost-effective method for SPI-compatible serial interface integrating accurate, multiaxis inertial sensing into industrial Wide bandwidth: 330 Hz systems, especially when compared with the complexity and Embedded temperature sensor investment associated with discrete designs. All necessary motion Programmable operation and control testing and calibration are part of the production process at the Automatic and manual bias correction controls factory, greatly reducing system integration time. Tight orthog- Bartlett window, FIR filter length, number of taps onal alignment simplifies inertial frame alignment in navigation Digital I/O: data ready, alarm indicator, general-purpose systems. An improved SPI interface and register structure provide Alarms for condition monitoring faster data collection and configuration control. Sleep mode for power management DAC output voltage The ADIS16364 uses a compatible pinout and the same package Enable external sample clock input: up to 1.2 kHz as the ADIS1635x family. Therefore, systems that currently use the Single-command self-test ADIS1635x family can upgrade their performance with minor Single-supply operation: 4.75 V to 5.25 V firmware adjustments in their processor designs. 2000 g shock survivability This compact module is approximately 23 mm 23 mm 23 mm Operating temperature range: 40C to +105C and provides a flexible connector interface that enables multiple APPLICATIONS mounting orientation options. Medical instrumentation Robotics Platform controls Navigation FUNCTIONAL BLOCK DIAGRAM AUX ADC AUX DAC TEMPERATURE SENSOR TRIAXIS MEMS CS ANGULAR RATE SENSOR SIGNAL CALIBRATION OUTPUT SCLK CONDITIONING REGISTERS AND AND AND SPI DIN DIGITAL CONVERSION INTERFACE PROCESSING DOUT TRIAXIS MEMS ACCELERATION SENSOR ALARMS POWER VCC MANAGEMENT DIGITAL SELF-TEST CONTROL GND ADIS16364 RST DIO1 DIO2 DIO3 DIO4/ CLKIN Figure 1. Rev. F Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. No Tel: 781.329.4700 20092019 Analog Devices, Inc. All rights reserved. license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Technical Support www.analog.com Trademarks and registered trademarks are the property of their respective owners. 07906-001ADIS16364 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Burst Read Data Collection ...................................................... 12 Applications ....................................................................................... 1 Output Data Registers ............................................................... 12 General Description ......................................................................... 1 C a l ibr at ion ................................................................................... 13 Functional Block Diagram .............................................................. 1 Operational Control ................................................................... 13 Revision History ............................................................................... 2 Input/Output Functions ............................................................ 15 Specif icat ions ..................................................................................... 4 Diagnostics .................................................................................. 16 Timing Specifications .................................................................. 6 Product Identification ................................................................ 17 Timing Diagrams .......................................................................... 6 Applications Information .............................................................. 18 Absolute Maximum Ratings ............................................................ 7 Installation/Handling................................................................. 18 ESD Caution .................................................................................. 7 Gyroscope Bias Optimization ................................................... 18 Pin Configuration and Function Descriptions ............................. 8 Input ADC Channel ................................................................... 18 Typical Performance Characteristics ............................................. 9 ADIS16IMU2/PCBZ .................................................................. 18 Theory of Operation ...................................................................... 10 PC-Based Evaluation Tools ....................................................... 18 Basic Operation .......................................................................... 10 X-Ray Sensitivity ........................................................................ 18 Reading Sensor Data .................................................................. 10 Outline Dimensions ....................................................................... 19 Device Configuration ................................................................ 10 Ordering Guide .......................................................................... 19 Memory Map .............................................................................. 11 REVISION HISTORY 3/2019Rev. E to Rev. F Changes to Burst Read Data Collection Section, Output Data Added Endnote 1, Table 1 Renumbered Sequentially ................ 5 Registers Section, and Table 9 ....................................................... 11 Deleted Interface Printed Circuit Board (PCB) Section and Added Table 10, Table 11, Table 12, Table 13, and Table 14 Figure 17 Renumbered Sequentially ........................................... 17 Renumbered Tables Sequentially ................................................. 11 Added ADIS16IMU2/PCBZ Section, PC-Based Evaluation Changes to Internal Sample Rate Section ................................... 12 Tools Section, and X-Ray Sensitivity Section ............................. 18 Added Sensor Bandwidth Section and Figure 14 Changes to Figure 17 ...................................................................... 18 Renumbered Figures Sequentially ................................................ 13 Changes to Outline Dimensions ................................................... 19 Changes to Digital Filtering Section and Table 20 ..................... 13 Changes to General-Purpose I/O Section ................................... 14 Changes to Ordering Guide .......................................................... 19 Changes to Table 26 ....................................................................... 15 9/2012Rev. D to Rev. E Changes to Table 29 and Table 31 ................................................ 16 Change to Device Configuration Section ...................................... 9 Added Product Identification Section ......................................... 16 Added Applications Information Section, Figure 17, 2/2011Rev. C to Rev. D and Figure 18 ................................................................................... 17 Changes to Gyroscopes Misalignment and Accelerometers Moved Input ADC Channel Section and Figure 16................... 17 Misalignment Test Conditions/Comments, Table 1 .................... 3 Changes to Table 30 and Table 31 ................................................ 16 3/2009Rev. A to Rev. B Changes to Features Section ............................................................ 1 8/2010Rev. B to Rev. C Changes to Figure 5 and Figure 6 .................................................... 7 Reorganized Layout ............................................................ Universal Changes to Figure 7 ........................................................................... 8 Changes to Features Section............................................................ 1 Changes to Devices Configuration Section ................................... 9 Changes to Table 1 ............................................................................ 3 Changes to Figure 12 ...................................................................... 10 Changes to Table 2 ............................................................................ 5 Changes to Output Data Registers Section ................................. 11 Changes to Table 5 ............................................................................ 7 Changes to Internal Sample Rate Section, Power Management Changes to Table 7, Reading Sensor Data Section, Section, Digital Filtering Section, and the Dynamic Range and Device Configuration Section ................................................. 9 S ection .............................................................................................. 12 Changes to Table 8 .......................................................................... 10 Rev. F Page 2 of 21

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