High Accuracy, Ultralow I , 200 mA, Q SOT-23, anyCAP Low Dropout Regulator Data Sheet ADP3330 FEATURES SIMPLIFIED FUNCTIONAL BLOCK DIAGRAM High accuracy over line and load Q1 1 IN 2 OUT 0.7% at +25C ADP3330 R1 THERMAL 1.4% over temperature PROTECTION CC Ultralow dropout voltage: 140 mV (typical) at 200 mA ERR 3 Requires only C = 0.47 F for stability g OUT DRIVER m anyCAP = stable with any type of capacitor, including R2 SD 6 BAND GAP multilayer ceramic capacitors (MLCC) REF Current and thermal limiting Low noise 4 GND Low shutdown current: <2 A 2.9 V to 12 V supply range Figure 1. 40C to +85C ambient temperature range Ultrasmall, thermally enhanced, chip-on-lead 6-lead SOT-23 package APPLICATIONS Cell phones Notebook and palmtop computers Battery-powered systems PCMCIA regulators Bar code scanners Camcorders and cameras GENERAL DESCRIPTION The ADP3330 is a member of the Analog Devices, Inc., precision reduced to less than 2 A. The ADP3330 has an ultralow low dropout (LDO) anyCAP voltage regulator family of products. ground current 34 A (typical) in light load situations. The ADP3330 operates with an input voltage range of 2.9 V to The 6-lead SOT-23 package has been thermally enhanced using 12 V and delivers a load current up to 200 mA. The ADP3330 Analog Devices proprietary chip-on-lead feature to maximize stands out from the conventional LDOs with a novel architecture power dissipation. and an enhanced process that enables it to offer performance advantages and higher output current than its competition. Its NR ERR patented design requires only a minimum output capacitor of ADP3330 0.47 F for stability. This device is insensitive to output capacitor V IN IN OUT V OUT equivalent series resistance (ESR), and is stable with any good C + + IN C OUT 0.47F 0.47F quality capacitor, including ceramic (MLCC) types for space SD GND restricted applications. The ADP3330 achieves exceptional ON accuracy of 0.7% at room temperature and 1.4% over OFF temperature, line and load variations. The dropout voltage of the ADP3330 is only 140 mV (typical) at 200 mA. This device also Figure 2. Typical Application Circuit includes a safety current limit, thermal overload protection, and a shutdown feature. In shutdown mode, the ground current is Rev. C Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. No Tel: 781.329.4700 19992015 Analog Devices, Inc. All rights reserved. license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Technical Support www.analog.com Trademarks and registered trademarks are the property of their respective owners. 12098-002 12098-001ADP3330 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Capacitor Selection .................................................................... 11 Applications ....................................................................................... 1 Noise Reduction ......................................................................... 11 Simplified Functional Block Diagram ........................................... 1 Chip-on-Lead Package .............................................................. 11 General Description ......................................................................... 1 Thermal Overload Protection .................................................. 11 Revision History ............................................................................... 2 Calculating Junction Temperature ........................................... 12 Specifications ..................................................................................... 3 Printed Circuit Board (PCB) Layout Considerations ........... 12 ADP3330 ........................................................................................ 3 Error Flag Dropout Detector .................................................... 12 ADP3330-2.5 ................................................................................. 4 Shutdown Mode ......................................................................... 12 Absolute Maximum Ratings ............................................................ 5 Low Power, Low Dropout Applications .................................. 12 ESD Caution .................................................................................. 5 Application Circuits ....................................................................... 13 Pin Configuration and Function Descriptions ............................. 6 Crossover Switch ........................................................................ 13 Typical Performance Characteristics ............................................. 7 Higher Output Current ............................................................. 13 Theory of Operation ...................................................................... 10 Outline Dimensions ....................................................................... 14 Applications Information .............................................................. 11 Ordering Guide .......................................................................... 14 REVISION HISTORY 5/15Rev. B to Rev. C Changes to General Description Section ...................................... 1 Changes to Chip-On-Lead Package Section ............................... 11 Changes to Ordering Guide .......................................................... 14 5/14Rev. A to Rev. B Updated Format .................................................................. Universal Changed 0.47 mF to 0.47 F, Features Section ............................. 1 Changes to General Description Section ...................................... 1 Changed 2.5 V to 2.5 V, ADP3330-xx Section .......................... 3 Changes to Table 1 ............................................................................ 3 Changes to Table 2 ............................................................................ 4 Changes to Figure 4 Caption through Figure 7 Caption ............. 7 Changes to Figure 10, Figure 13 Caption, Figure 14 Caption, and Figure 15 ..................................................................................... 8 Changes to Figure 16, Figure 17, and Figure 19 Caption ............ 9 Changes to Printed Circuit Board (PCB) Layout Considerations Section, and Low Power, Low Dropout Applications Section .. 12 Updated Outline Dimensions ....................................................... 14 Changes to Ordering Guide .......................................................... 14 8/99Rev. 0 to Rev. 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