MC78L00A Series, NCV78L00A 100 mA Positive Voltage Regulators The MC78L00A Series of positive voltage regulators are inexpensive, easytouse devices suitable for a multitude of www.onsemi.com applications that require a regulated supply of up to 100 mA. Like their higher powered MC7800 and MC78M00 Series cousins, these regulators feature internal current limiting and thermal shutdown making them remarkably rugged. No external components are required with the MC78L00 devices in many applications. These devices offer a substantial performance advantage over the traditional zener dioderesistor combination, as output impedance 1 1 and quiescent current are substantially reduced. 2 2 3 3 STRAIGHT LEAD BENT LEAD Features BULK PACK TAPE & REEL Wide Range of Available, Fixed Output Voltages AMMO PACK Low Cost TO92 Pin: 1. Output 2. Ground P SUFFIX Internal Short Circuit Current Limiting 3. Input CASE 029 Internal Thermal Overload Protection No External Components Required Complementary Negative Regulators Offered (MC79L00A Series) NCV Prefix for Automotive and Other Applications Requiring SOIC8* Unique Site and Control Change Requirements AECQ100 D SUFFIX SOT89 CASE 751 CASE 528AG Qualified and PPAP Capable These are PbFree Devices *SOIC8 is an internally modified SO8 package. Pins 2, 3, 6, and 7 are electrically common to the die attach flag. This internal lead frame modification decreases package thermal resistance and increases power Input Q11 Q5 Q3 dissipation capability when appropriately mounted on 15k a printed circuit board. SOIC8 conforms to all ex- Q12 ternal dimensions of the standard SO8 package. Q1 Q10 PIN CONNECTIONS 5.0k 3.0 Output 3.8k V18 V OUT IN Q4 Q6 0-25k 2 7 GND GND GND 3 6 GND 1.9k 19k 2.2k 1.2k NC 4 5 NC Q9 C (Top View) Q8 Q2 TAB Z1 2.85k Q7 420 1.0k Ground 12 3 V GND V OUT IN (Top View) Figure 1. Representative Schematic Diagram ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet. DEVICE MARKING INFORMATION See general marking information in the device marking section on page 12 of this data sheet. Semiconductor Components Industries, LLC, 1999 1 Publication Order Number: October, 2016 Rev. 18 MC78L00A/DMC78L00A Series, NCV78L00A MC78LXXA Input Output C * in C ** O 0.33 F 0.1 F Figure 2. Standard Application A common ground is required between the input and the output voltages. The input voltage must remain typically 2.0 V above the output voltage even during the low point on the input ripple voltage. * C is required if regulator is located an appreciable distance from power supply filter. in ** C is not needed for stability however, it does improve transient response. O ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage (5.0 V9.0 V) V 30 Vdc I Input Voltage (12 V18 V) 35 Input Voltage (24 V) 40 Storage Temperature Range T 65 to +150 C stg Maximum Junction Temperature T 150 C J Moisture Sensitivity Level MSL 1 ESD Capability, Human Body Model (Note 1) ESD 2000 V HBM ESD Capability, Machine Model (Note 1) ESD 200 V MM ESD Capability, Charged Device Model (Note 1) ESD 2000 V CDM Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AECQ100002 (EIA/JESD22A114) ESD Machine Model tested per AECQ100003 (EIA/JESD22A115) ESD Charged Device Model tested per EIA/JES D22/C101, Field Induced Charge Model. THERMAL CHARACTERISTICS Rating Symbol Value Unit Package Dissipation PD Internally Limited W Thermal Characteristics, TO92 R 200 C/W JA Thermal Resistance, JunctiontoAmbient Thermal Characteristics, SOIC8 R Refer to Figure 8 C/W JA Thermal Resistance, JunctiontoAmbient Thermal Characteristics, SOT89 R 55 C/W JA Thermal Resistance, JunctiontoAmbient 2. Thermal Resistance, JunctiontoAmbient depends on P.C.B. Copper area. See details in Figure 8. Thermal Resistance, JunctiontoCase is not defined. SOIC 8 lead and TO-92 packages that do not have a heat sink like other packages may have. This is the reason that a Theta JC is never specified. A little heat transfer will occur through the package but since it is plastic, it is minimal. The majority of the heat that is transferred is through the leads where they connect to the circuit board. www.onsemi.com 2