Evaluation Kit Design Tools Support Available Resources and Models Click here to ask an associate for production status of specific part numbers. Automotive High-Current Step-Down Converter with MAX20037/MAX20038 USB Protection/Host Charger Adapter Emulation General Description Benefits and Features The MAX20037/MAX20038 ICs combine a 3.5A (or 1.5A One-Chip Solution Directly from Car Battery to for MAX20038A) automotive-grade step-down converter, Portable Device USB host charger adapter emulator, and USB protection 4.5V to 28V (40V Load Dump) Input Voltage switches for automotive USB host applications. The device 5V, 3.5A Output Current Capability family also includes a USB load current-sense amplifier 5V, 1.5A Output Current Capability (MAX20038A) and configurable feedback-adjustment circuit, designed to Device-Attach Detection Output provide automatic USB voltage compensation for voltage Low-Q Current Skip and Shutdown Modes drops in captive cables often found in automotive applica- Low-Noise Features Prevent Interference with AM tions. The ICs limit the USB load current using both a fixed Band and Portable Devices internal peak-current threshold of the DC-DC converter Fixed-Frequency 275kHz to 2.2MHz Operation and a user-configurable external USB load current-sense Fixed-PWM Option at No Load amplifier threshold. The ICs can be configured to be a 2.4A Spread Spectrum for EMI Reduction Apple R30+ compliant solution. SYNC Input/Output for Frequency Parking The ICs allow flexible configuration options for both Optimal USB Power and Communication for Portable stand-alone and supervised applications, and can be pro- Devices grammed for desired operation using both external pro- 2 gramming resistors and/or internal I C registers through User-Programmable Voltage Gain Adjusts Output 2 the I C bus. for Up to 600m Cable Resistance User-Programmable USB Current Limit The ICs are optimized for high-frequency operation and USB 480Mbps/12Mbps/1.5Mbps Data Switches include programmable frequency selection from 310kHz Integrated iPod /iPhone /iPad and Samsung to 2.2MHz, allowing optimization of efficiency, noise, and Charge-Detection Termination Resistors board space based on application requirements. The Supports USB BC1.2 CDP and DCP Modes fully synchronous DC-DC converters feature integrated Supports China YD/T 1591-2009 high-side and low-side MOSFETs, an external SYNC Compatible with USB On-the-Go Specification input/output, and can be configured for spread-spectrum operation. Robust Design Keeps Vehicle System and Portable Devices Safe in Automotive Environment The MAX20037/MAX20038 are available in a small (5mm Short-to-Battery Protection on DC-DC x 5mm) 28-pin TQFN package (side-wettable available) Converter Pins designed to minimize required components and layout area. Short-to-VBUS Protection on USB Pins (MAX20037) Short-to-Battery Protection on USB Pins (MAX20038) Applications 15kV Air/8kV Contact ISO 10605* Automotive Radio and Navigation 15kV Air/8kV Contact IEC 61000-4-2* USB Port for Host and Hub Applications Reduced Inrush Current with Soft-Start Automotive Connectivity/Telematics Overtemperature Protection Dedicated USB Charging Port (DCP) -40C to +125C Operating Temperature Range Ordering Information and Typical Operating Circuit appear Simplified Typical Operating Circuit at the end of data sheet. VBAT MAX20037 *Tested in Typical Operating Circuit, as used on the RADIO CAPTIVE MAX20038 HEAD USB MAX20037/MAX20038 Evaluation Kit. DC-DC + USB CABLE +5V Apple, iPod, iPhone, and iPad are registered trademarks of USB HOST PORTABLE D- HVD- USB Apple Inc. CONNECTOR DEVICE PHY D+ HVD+ Samsung is a registered trademark of Samsung Electronics Co., Ltd. 19-100104 Rev 10 8/21 2021 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. One Analog Way, Wilmington, MA 01887 U.S.A. Tel: 781.329.4700 2021 Analog Devices, Inc. All rights reserved.MAX20037/MAX20038 Automotive High-Current Step-Down Converter with USB Protection/Host Charger Adapter Emulation Absolute Maximum Ratings SUPSW to PGND ..................................................-0.3V to +40V LX Continuous RMS Current (MAX20037/MAX20038) ......3.5A LX, HVEN to PGND (Note 1) ............ -0.3V to (V + 0.3V) LX Continuous RMS Current (MAX20038A) .......................1.7A SUPSW BIAS to SUPSW ................................................ V + 0.3V Output Short-Circuit Duration ....................................Continuous SUPSW DRV to PGND ........................................-0.3V to (V + 0.3V) Continuous Power Dissipation (T = +70C) BIAS A FBCAP, SYNC to AGND.........................-0.3V to (V + 0.3V) 28-pin TQFN (derate 34.5mW/C > 70C) ............... 2759mW BIAS SENSN, SENSP, INT to AGND ......... -0.3V to (V + 0.3V) Operating Temperature .................................... -40C to +125C SUPSW AGND to PGND ....................................................-0.3V to +0.3V Junction Temperature ......................................................+150C BST to PGND ........................................................-0.3V to +46V Storage Temperature Range ............................ -65C to +150C BST to LX ...............................................................-0.3V to +6V Lead Temperature (soldering, 10s) .................................+300C IN, CONFIG1, ENBUCK, SDA, SCL, to AGND ......-0.3V to +6V Soldering Temperature (reflow) .......................................+260C BIAS, CDP/DCP, FAULT, SHIELD to AGND ..........-0.3V to +6V HVD+, HVD- to AGND (MAX20037) ......................-0.3V to +6V HVD+, HVD- to AGND (MAX20038) ....................-0.3V to +18V Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note 1: Self-protected from transient voltages exceeding these limits in circuit under normal operation. Package Information PACKAGE TYPE: 28 TQFN Package Code T2855+6C Outline Number 21-0140 Land Pattern Number 90-0026 PACKAGE TYPE: 28 SWTQFN Package Code T2855Y+6C Outline Number 21-100041 Land Pattern Number 90-0026 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 29C/W JA Junction to Case ( ) 2C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Analog Devices 2 www.analog.com