EVALUATION KIT AVAILABLE Click here for production status of specific part numbers. MAX20463/MAX20463A USB Type-A to Type-C Port Converter with Protection General Description Benefits and Features The MAX20463 is a small, integrated USB Type-C USB Type-C R1.3 compliance with integrated V BUS Downstream-Facing Port (DFP) solution used to convert Discharge an existing USB-A head-unit captive-cable port to a head- USB Type-C 1.5A and 3.0A DFP Controller unit USB Type-C captive-cable port. When the MAX20463 Type-C Current Limit Reduction with V Dropout BUS is designed into an automotive module at the end of the Designed for Cooperative Protection with Head-Unit cable, then the existing upstream head-unit USB-A Protector solution and the existing USB-A captive-cable housing Short-to-Battery and Short-to-Ground Survival on can be reused. HVBUS for Upstream Protector to Handle Accurate USB Bus Forward Current Threshold The device protection features include 15kV/8kV IEC 61000-4-2 ESD on CC1/CC2, and IEC ESD with short- Low R 28m (Typ) USB Power Switch ON to-battery (18V) on SENSE/HVBUS. The MAX20463A Robust Design Keeps Vehicle System and Portable senses a short of the passenger cable shield to car bat- Devices Safe in Automotive Environment tery, preventing damage to the port. Short-to-ground and Optional Shield Short-to-Battery Detection and short-to-battery survival are also provided on the HVBUS External FET Control signal and defined to operate in concert with the existing Short-to-BUS Protection on Protected CC1 and head-unit USB-A charger/protector, allowing coordinated CC2 Outputs fault detection and reporting to the head-unit USB host. IEC 61000-4-2 Level-4 ESD Protection (HVBUS, The device is compliant with the USB Type-C specifica- CC1, CC2, SENSE) tion. 3mm x 3mm 12-Pin TDFN Package The MAX20463 is available in a small, 3mm x 3mm, 12-pin -40C to +105C Operating Temperature Range TDFN package, using very few external components. AEC-Q100 Qualified Applications Ordering Information appears at end of data sheet. Automotive USB Captive-Cable Housing Automotive Downstream USB Modules Simplified Block Diagram USB TYPE-C USB TYPE A USB TYPE A RECEPTACLE D- D- D- D- CAPTIVE CABLE UPSTREAM HEAD D+ D+ D+ D+ UNIT 1m to 2m OR MULTIMEDIA MODULE USB-A PORT VBUS VBUS VBUS BUS HVBUS VBUS BUS HVBUS GND GND GND MAX20463A BIAS CC1 CC1 47F SHIELD SHIELD CC2 CC2 SENSE GND CC SEL GND GDRV SHIELD 19-100441 Rev 3 10/19MAX20463/MAX20463A USB Type-A to Type-C Port Converter with Protection Absolute Maximum Ratings BIAS, CC1, CC2, CC SEL, GDRV .........................-0.3V to +6V Operating Temperature Range ......................... -40C to +105C BUS, HVBUS, SENSE to GND .............................-0.3V to +18V Storage Temperature Range ............................ -65C to +150C BUS to HVBUS........................................................-0.3V to +9V Lead Temperature Range ................................................+300C Short-Circuit Between HVBUS and GND ............................. 3.5A Continuous Power Dissipation (Multilayer Board) (T = +70C, derate 41mW/C above +70C.) ..........1951mW A Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information TDFN Package Code TD1233+1C Outline Number 21-0664 Land Pattern Number 90-0397 Thermal Resistance, Four-Layer Board: Junction-to-Ambient ( ) 41C/W JA Junction-to-Case Thermal Resistance ( ) 8.5C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com