Click here to ask about the production status of specific part numbers. MAX22505 40V High-Speed USB Port Protector General Description Benefits and Features The MAX22505 is designed to protect a USB port on Robust Communications commercial and industrial equipment against damage due Integrated 50V dc Protection for V /GND BUS to faulty or incorrectly wired power supplies. The USB Integrated 40.7V dc Protection for D+/D- port is protected against connection to typical 24V or Thermal Shutdown Protected DC 24V systems with a max data line protection of 40.7V -40C to +105C Operating Temperature AC and power/ground line protection up to 50V. High Performance High (480Mb), Full (12Mb), and Low (1.5Mb) V , ground and connector shield connections can be BUS Speed Capable configured for any level of ESD, burst, and surge protection 3.0V to 5.5V Supply Voltage by choosing external components. USB data D+ and 4 (typ) V /D+/D- channel resistance BUS D- are protected by external diode clamps to V and BUS 1 (max) GND Channel Resistance GND, allowing for the lowest possible insertion loss while High-Speed USB Disable Mode Allowing Operation providing high ESD and Burst protection. with High Common Mode Voltages The MAX22505 is housed in a 24-pin, 4mm x 4mm TQFN Flexibility package with exposed pad and is specified for operation Transparent to USB Operation Speeds over the -40C to +105C temperature range. Configurationless USB Host or Device Protection Optional External MOSFET driver for V and BUS Applications GND Paths Industrial PC Supports USB OTG Programmable Logic Controller (PLC) Simpler Than USB Isolation Diagnostic USB port Ordering Information appears at end of data sheet. Application Block Diagram 3V TO 5V VCC MAX22505 FLTB HCMB SHIELD GNDS GND USB CONNECTOR PROTECTED (TYPE A, B, MINI-B SYSTEM USB OR MICROB) UGND GND GNDA GTGC GTGP VBUS VBUS PVBUS GTVC GTVP D- DN PDN D+ DP PDP 19-100235 Rev 2 6/20MAX22505 40V High-Speed USB Port Protector Absolute Maximum Ratings (Voltages referenced to GND.) Continuous Current V , FLTB, HCMB .............................................. -0.3V to +6.0V GTGC, GTGP, GTVC, GTVP ..........................................10mA CC DN to PDN, DP to PDP ....................................-40.7V to +40.7V V to PVBUS, UGND to GNDS ...............................280mA BUS V to PVBUS, UGND to GNDS ...................-50.0V to +50.0V Any other pin ..................................................................50mA BUS GTGC to UGND ..................................................... -0.3 to +6.0V Continuous Power Dissipation (T = +70C) A GTGP to GNDS ...................................................... -0.3 to +6.0V T2444-2C TQFN (Multi Layer) GTVC to V ....................................................... -0.3 to +6.0V (derate by 25.6mW/C above +70C)........................2051mW BUS GTVP to PVBUS .................................................... -0.3 to +6.0V Operating Temperature Range ......................... -40C to +105C PVBUS .................................................................-0.3V to +6.0V Junction Temperature ......................................................+150C GNDS ...................................................................-0.6V to +0.6V Storage Temperature Range ............................ -65C to +150C PDN, PDP.............................................................-0.3V to +6.0V Lead Temperature (Soldering, 10s) .................................+300C Soldering Temperature (reflow) .......................................+260C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 1) TDFN (Multi-Layer PCB) TDFN (Single-Layer PCB) Junction-to-Ambient Thermal Resistance ( ) ..........39C/W Junction-to-Ambient Thermal Resistance ( ) ..........56C/W JA JA Junction-to-Case Thermal Resistance ( ) .................6C/W Junction-to-Case Thermal Resistance ( ) .................6C/W JC JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (V = +3.0V to +5.5V, T = T to T , unless otherwise noted. Typical values are at V = 5.0V, T = +25C.) Limits are 100% CC A MIN MAX CC A tested at T = +25C. Limits over the operating temperature range and relevant supply voltage range are guaranteed by design and A characterization. PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLY V Supply Voltage Range 3.0 5.5 V CC Supply Voltage Range V External MOSFETs present 4.75 5.5 V CC I Supply Current 3.8 5.9 mA CC Power-On Reset Voltage V Measured at V 2.75 V POR CC Power-On Reset Delay t 10 ms POR V - V , V 4.75V, GTGC UGND CC V GTGC Voltage 4.5 5.1 5.7 V GTGC I = 0.5A GTGC V - V , V 4.75V, GTGP GND CC GTGP Voltage V 4.5 5.1 5.7 V GTGP I = 0.5A GTGP V - V , V 4.75V, GTVC VBUS CC GTVC Voltage V 4.5 5.1 5.7 V GTVC I = 0.5A GTVC V - V , V 4.75V, GTVP PVBUS CC GTVP Voltage V 4.5 5.1 5.7 V GTVP I = 0.5A GTVP GND CHANNEL R On Resistance 0.5 1.0 ONGND R ONGND -0.3V V +0.3V On Resistance Flatness 0.1 UGND FLAT GND Resistor R UGND to GND 50 k GND Maxim Integrated 2 www.maximintegrated.com