EVALUATION KIT AVAILABLE Click here to ask about the production status of specific part numbers. MAX25430 Automotive 100W USB-PD Buck-Boost Port Controller and Protector General Description Benefits and Features The MAX25430 combines an automotive-grade buck- USB-PD PHY That is TCPCI Standard for Use with 2 boost controller capable of driving up to 5.0A, a USB-PD Any Low-Cost I C Master Such as Hub IC, MCU or Analog Front-End (AFE), Legacy USB Charging support SOC (MAX25430B) and USB Type-C protection for USB host or DFP ap- Ground-Offset-Adjusted BMC PHY for Maximum plications. The USB Type-C protection switches provide Signal-to-Noise Ratio automotive system-level ESD and 24V short-circuit pro- Non-TCPC Versions Available for Protecting External tection for D+, D-, CC1, CC2, and VCONN. The device USB-PD Controller (MAX25430A) also supports legacy USB 2.0 charging modes including Integrated Buck-Boost Controller for External H-bridge BC1.2, Apple 2.4A, Apple CarPlay, Apple MFi and 4.5V to 36V Input Operating Range USB On-The-Go (OTG). Fixed PDO 5V, 9V, 15V and 20V up to 5.0A The MAX25430B integrates a USB-PD AFE which sup- 220kHz, 300kHz or 400kHz Switching Frequency ports the USB-IF Type-C Port Controller Interface (TCPCI) External Frequency Synchronization and Spread specification and can interface with any I2C Master in the Spectrum for Reduced EMI application. Integrated and User-Programmable Buck-Boost The MAX25430A provides CC signal passthrough protec- Output Voltage Adjustment up to 500m of Cable tion for an external USB-PD controller. Resistance G-Suffix devices include intelligent detection and protec- Highest Performance, Safest, and Lowest Cost tion to avoid high short-circuit currents flowing from the Passenger Cable-Shield Short-to-Battery Protection car battery through the cable shield to ground during fault Minimizes Short-Circuit Currents with a Small, events, preventing car module damage. Single-FET Solution The MAX25430 EVKIT and collateral provides a conve- Integrated 3.0V to 5.5V 1W Smart, Reliable VCONN nient platform to the design engineer for rapid evaluation Switch with Protection with reduced test and firmware development time. The Integrated 24V Protection on HVD+, HVD-, HVCC1 MAX25430 is available in a small 6mm x 6mm 40-pin and HVCC2 TQFN package and requires very few external compo- Integrated Legacy USB 2.0 Charging Support nents. including BC1.2, Apple CarPlay, MFi R33, and OTG Integrated 15kV Air, 8kV Contact ISO 10605 and IEC 61000-4-2 ESD Protection Applications -40C to 125C Operating Temperature Range USB Hubs, Breakout Boxes and Multimedia Hubs 40-Pin (6mm x 6mm) TQFN Package with EP Dedicated Charging Modules AEC-Q100 and AEC-Q006 Qualified Rear-Seat Entertainment Modules Ordering Information appears at end of data sheet. Simplified Block Diagram VBAT VBAT VBUS VBUS BUCK-BOOST BUCK-BOOST H-BRIDGE FETs H-BRIDGE FETs 3.0V 5.5V 3.0V 5.5V VCONN VCONN MAX25430AMAX25430A MAX25430BMAX25430B USB USB TYPE-C TYPE-C DC-DC + Protector DC-DC + Protector VDD PORT PORT + USB-PD VDD LOW-VOLTAGE CC1 / CC2 CC1 / CC2 USB-PD HVCC1 / MCU HVCC1 / HVCC2 HVCC2 CONTROLLER or I2C I2C ASIC WITH INTEGRATED HVD+ / HVD+ / USB TRANSCEIVER D+ / D- D+ / D- HVD- HVD- 19-100826 Rev 0 7/20MAX25430 Automotive 100W USB-PD Buck-Boost Port Controller and Protector Absolute Maximum Ratings IN to PGND ............................................................. -0.3V to +40V PGND to AGND .....................................................-0.3V to +0.3V HVEN, CSP1, CSN1 to PGND .........................-0.3V to V +0.3V HVCC1, HVCC2, HVDP, HVDM to AGND ..............-0.3V to +24V IN LX1 to PGND (Note 1) ......................................-0.3V to V +0.3V SHLD SNS to AGND ..............................................-0.3V to +24V IN OUT, CSP2, CSN2 to PGND ................................. -0.3V to +30V CC1, CC2, VCONN to AGND ...................................-0.3V to +6V LX2 to PGND (Note 1) ......................................-0.3V to V +0.3V DP, DM to AGND ............................... -0.3V to (V +0.3)V IN VDD USB CSP to CSN ...................................................... -0.3V to +0.3V ADDR, ALERT, GDRV, FSYNC, to AGND ...............-0.3V to +6V BST1 to LX1, BST2 to LX2 ....................................... -0.3V to +6V SCL, SDA to AGND .............................. -0.3V to (V +0.3)V VDD IO BST1, DH1 to PGND .............................................. -0.3V to +46V Continuous Power Dissipation (Note 2) ..........................2963mW BST2, DH2 to PGND .............................................. -0.3V to +36V Operating Temperature Range ..........................-40 C to +125C DH to LX .................................................. -0.3V to V +0.3V Junction Temperature .......................................................+150C BST DL , COMP, FB to PGND ............................-0.3V to V +0.3V Storage Temperature Range ..............................-40C to +150C BIAS BIAS, V , V , V , to AGND ........ -0.3V to +6V Soldering Temperature (reflow) ........................................+260C DD USB DD IO DD BMC Note 1: Self-protected from transient voltages exceeding these limits in circuit under normal operation. Note 2: Multilayer Board T = +70C, derate 37mW/C above +70C. A Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information TQFN Package Code T4066+5C Outline Number 21-0141 Land Pattern Number 90-0055 Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) 27C/W JA Junction to Case ( ) 1C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (V = 14V, V = V , V = 5V, V = 3.3V, T = -40C to +125C, unless otherwise noted. Typical values are at T = IN HVEN IN VCONN VDD IO A A 25C. (Note 3)) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLY Input Voltage Range on V 4.5 36 V IN IN IN Supply Current - Off V = 18V, HVEN = 0V, V = 0V, IN VCONN I 16 A IN OFF State OFF State IN Supply Current - I Powered Enabled VBUS OFF 2.3 mA IN STDBY Standby State V Rising. Default setpoint. IN IN Undervoltage V Programmable from 4.5V to 8.5V in 0.4V 7.3 V IN UVLO Lockout Threshold steps with IN UV THRESH 3:0 register. www.maximintegrated.com Maxim Integrated 2