MAX3301E/MAX3302E 19-3275 Rev 3 10/07 USB On-the-Go Transceivers and Charge Pumps General Description Features The MAX3301E/MAX3302E fully integrated USB On-the- USB 2.0-Compliant Full-/Low-Speed OTG Go (OTG) transceivers and charge pumps allow mobile Transceivers devices such as PDAs, cellular phones, and digital Ideal for USB On-the-Go, Embedded Host, or cameras to interface directly with USB peripherals and Peripheral Devices each other without the need of a host PC. Use the 15kV ESD Protection on ID IN, V , D+, and D- BUS MAX3301E/MAX3302E with an embedded USB host to Terminals directly connect to peripherals such as printers or Charge Pump for V Signaling and Operation external hard drives. BUS Down to 3V The MAX3301E/MAX3302E integrate a USB OTG trans- Internal V and ID Comparators BUS ceiver, a V charge pump, a linear regulator, and an BUS 2 I C-compatible, 2-wire serial interface. An internal level Internal Switchable Pullup and Pulldown shifter allows the MAX3301E/MAX3302E to interface Resistors for Host/Peripheral Functionality with +1.65V to +3.6V logic supply voltages. The 2 I C Bus Interface with Command and Status MAX3301E/MAX3302Es OTG-compliant charge pump Registers operates with +3V to +4.5V input supply voltages, and Linear Regulator Powers Internal Circuitry and supplies an OTG-compatible output on V while BUS D+/D- Pullup Resistors sourcing more than 8mA of output current. Support SRP and HNP The MAX3301E/MAX3302E enable USB OTG communi- cation from highly integrated digital devices that cannot supply or tolerate the +5V V levels that USB OTG BUS Ordering Information requires. The device supports USB OTG session-request PACKAGE protocol (SRP) and host-negotiation protocol (HNP). PIN- PKG PART SIZE The MAX3301E/MAX3302E provide built-in 15kV elec- PACKAGE CODE (mm) trostatic-discharge (ESD) protection for the V , ID IN, BUS D+, and D- terminals. The MAX3301E/MAX3302E are MAX3301EEBA-T 2.5 x 2.5 25 UCSP B25-1 available in 25-bump chip-scale (UCSP), 25-bump MAX3301EETJ 5 x 5 32 TQFN-EP** T3255-4 WLP package, 28-pin TQFN, and 32-pin TQFN pack- MAX3302EEBA-T* 2.5 x 2.5 25 UCSP B25-1 ages and operate over the extended -40C to +85C MAX3302EETI 4 x 4 28 TQFN-EP** T2844-1 temperature range. MAX3302EEWA+T 2.54 x 2.54 25 WLP W252A2-1 Selector Guide Note: All devices specified over the -40C to +85C operating 2 range. I C ADDRESSES FOR UCSP bumps are in a 5 x 5 array. The UCSP package size is PART POWER-UP STATE SPECIAL-FUNCTION 2.5mm x 2.5mm x 0.62mm. Requires solder temperature profile REGISTER 2 described in the Absolute Maximum Ratings section. UCSP reli- ability is integrally linked to the users assembly methods, circuit Shutdown (sdwn = 1, board material and environment. See the UCSP Applications bit 0 of special- MAX3301E 16h, 17h Information section of this data sheet for more information. function register 2) *Future productcontact factory for availability. **EP = Exposed paddle. Operating (sdwn = 1, T = Tape and reel. MAX3302E bit 0 of special- 10h, 11h, and 16h, 17h +Denotes a lead-free package. function register 2) The MAX3301E powers up in its lowest power state and the MAX3302E powers up in the operational, VP/VM USB mode. Applications Mobile Phones Digital Cameras PDAs MP3 Players Pin Configurations appear at end of data sheet. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com.USB On-the-Go Transceivers and Charge Pumps ABSOLUTE MAXIMUM RATINGS All voltages are referenced to GND. Continuous Power Dissipation (T = +70C) A V , V .....................................................................-0.3V to +6V 25-Bump WLP (derate 12.2mW/C above +70C).......976mW CC L TRM (regulator off or supplied by V ) ..-0.3V to (V + 0.3V) 25-Bump UCSP (derate 12.2mW/C above +70C) ....976mW BUS BUS TRM (regulator supplied by V )...............-0.3V to (V + 0.3V) 32-Pin TQFN (5mm x 5mm x 0.8mm) (derate 21.3mW/C CC CC D+, D- (transmitter tri-stated) ...................................-0.3V to +6V above +70C).........................................................1702mW D+, D- (transmitter functional)....................-0.3V to (V + 0.3V) 28-Pin TQFN (4mm x 4mm x 0.8mm) (derate 20.8mW/C CC V .........................................................................-0.3V to +6V above +70C).........................................................1666mW BUS ID IN, SCL, SDA.......................................................-0.3V to +6V Operating Temperature Range ...........................-40C to +85C INT, SPD, RESET, ADD, OE/INT, RCV, VP, Junction Temperature......................................................+150C VM, SUS, DAT VP, SE0 VM ......................-0.3V to (V + 0.3V) Storage Temperature Range .............................-65C to +150C L C+.............................................................-0.3V to (V + 0.3V) Lead Temperature (soldering, 10s) .................................+300C BUS C-................................................................-0.3V to (V + 0.3V) Bump Reflow Temperature (Note 1) CC Short-Circuit Duration, V to GND .........................Continuous Infrared (15s) ...............................................................+200C BUS Vapor Phase (20s) .......................................................+215C Note 1: The UCSP package is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom- mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating is required. Hand or wave soldering is not allowed. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS (V = +3V to +4.5V, V = +1.65V to +3.6V, C = 100nF, C = 1F, ESR = 0.1 (max), T = T to T , unless CC L FLYING VBUS CVBUS A MIN MAX otherwise noted. Typical values are at V = +3.7V, V = +2.5V, T = +25C.) (Note 2) CC L A PARAMETER SYMB O L CONDITIONS MINTYPMAXUNITS Supply Voltage V 3.0 4.5 V CC TRM Output Voltage V 3.0 3.6 V TRM Logic Supply Voltage V 1.65 3.60 V L 2 V Supply Current I I C interface in steady state 5 A L VL USB normal mode, C = 50pF, device L V Operating Supply Current I 10 mA CC CC switching at full speed V = 1, I = 0 1.4 2 V Supply Current During Full- VBUS DRV VBUS CC mA Speed Idle V = 0, D+ = high, D- = low 0.5 0.8 VBUS DRV V Shutdown Supply Current I 3.5 10 A CC CC(SHDN) V Interrupt Shutdown Supply CC I ID IN unconnected or high 20 30 A CC(ISHDN) Current V Suspend Supply Current U SB suspend mo de, ID IN unconnected or hi gh 170 500 A CC LOGIC I/O RCV , DAT VP , SE 0 VM , INT, OE/INT, V P , VM Output Hi g h V I = 1mA (sourcing) V - 0.4 V OH OUT L V oltag e RCV, DAT VP, SE0 VM, INT, OE/INT, VP, VM Output Low V I = 1mA (sinking) 0.4 V OL OUT Voltage OE/INT, SPD, SUS, RESET, DAT VP, SE0 VM Input High V 2/3 x V V IH L Voltage 2 MAX3301E/MAX3302E