MAX9406 19-1024 Rev 0 10/07 DisplayPort to DVI/HDMI Level Shifter General Description Features The MAX9406 high-speed, low-skew, quad differential 500mV Differential HDMI Output at 2Gbps Data Rate input to current-mode logic (CML) translator features high-speed signal conversion of the DisplayPort (DP) 350ps Propagation Delay to High-Definition Multimedia Interface (HDMI ) technol- 20ps Channel-to-Channel Skew at 2Gbps ogy. This device features ultra-low propagation delay of 350ps and channel-to-channel skew of less than 20ps. Low Jitters: DJ = 11ps and RJ = 0.5ps P-P RMS The MAX9406 supports typical data rates of 2Gbps. Bidirectional Level Shifter of 5V to 3.3V for DDC The MAX9406 provides the level shift for HDMIs Display Data Channel (DDC) and hot-plug detection Pins (HPD), which converts the 5V single-ended logic to Level Shifter of 5V to 3.3V for I/Os 3.3V single-ended logic. The MAX9406 operates from a 3V to 3.6V core supply Integrated 50 Input Terminations and Biasing and is specified over the -40C to +85C extended tem- -40C to +85C Operating Temperature Range perature range. This device is available in 48-pin, 7mm x 7mm thin QFN and 32-pin, 5mm x 5mm thin QFN packages. Ordering Information Applications PKG Level Conversion for DP to HDMI PART TEMP RANGE PIN-PACKAGE CODE Data and Clock Driver and Buffer 32 Thin Q FN- E P * Backplane Data and Clock Distribution MAX9406ETJ+ -40C to +85C (5mm x 5mm x T3255-4 Base Stations 0.8mm) ATE 48 Thin Q FN- E P * M AX 9406E TM + -40C to +85C (7mm x 7mm x T4877-6 DVI is a trademark of Digital Display Working Group (DDWG). 0.8mm) DisplayPort is a trademark of Video Electronics Standards +Denotes a lead-free package. Association (VESA). *EP = Exposed paddle. HDMI is a trademark of HDMI Licensing, LLC. Pin Configurations TOP VIEW TOP VIEW 36 35 34 33 32 31 30 29 28 27 26 25 GND 37 24 GND 24 23 22 21 20 19 18 17 IN D1- 23 OUT D1- 38 25 16 OUT D1- IN D1- IN D1+ 39 22 OUT D1+ OUT D1+ IN D1+ 26 15 V 40 21 V CC CC 14 IN D2- 27 OUT D2- IN D2- 41 20 OUT D2- 28 13 OUT D2+ IN D2+ 42 19 OUT D2+ IN D2+ MAX9406 18 MAX9406 GND 43 GND IN D3- 29 12 OUT D3- IN D3- 44 17 OUT D3- IN D3+ 30 11 OUT D3+ IN D3+ 45 16 OUT D3+ 31 EP* 10 IN D4- OUT D4- V VCC 46 15 CC + EP* IN D4+ 32 9 OUT D4+ IN D4- 47 14 OUT D4- + 13 IN D4+ 48 OUT D4+ 12 3 4 5 6 7 8 1 2 3 4567 89 10 11 12 32 TQFN-EP 48 TQFN-EP 5mm 5mm 7mm 7mm *EP EXPOSED PADDLE. CONNECT EP TO GND. *EP EXPOSED PADDLE. CONNECT EP TO GND. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com. EVALUATION KIT AVAILABLE GND GND N.C. VCC N.C. N.C. V N.C. CC GND DDC EN N.C. GND HPD SRC HPD SNK SDA SRC SDA SNK SCL SNK SCL SRC N.C. GND V V CC CC GND OE GND V CC V CC DDC EN GND GND HPD SRC HPD SNK SDA SRC SDA SNK SCL SRC SCL SNK V GND CC GND OEDisplayPort to DVI/HDMI Level Shifter ABSOLUTE MAXIMUM RATINGS V to GND..............................................................-0.3V to +4V Operating Temperature Range ..-40C to +85C CC All Pins to GND...........................................-0.3V to (V + 0.3V) Junction Temperature+150C CC Short-Circuit Duration (all outputs).............................Continuous Storage Temperature Range -65C to +150C Continuous Power Dissipation (T = +70C) ESD Protection A 32-Pin Thin QFN (derate 21.3mW/C above +70C) .1702mW Human Body Model (R = 1.5k, C = 100pF) D S 48-Pin Thin QFN (derate 27.8mW/C above +70C) .2222mW IN D and OUT D to GND..........................................1.5kV Junction-to-Case Thermal Resistance ( ) (Note 1) Lead Temperature (soldering, 10s).+300C JC 32-Pin Thin QFN........................................................+1.7C/W 48-Pin Thin QFN........................................................+0.8C/W Junction-to-Ambient Thermal Resistance ( ) (Note 1) JA 32-Pin Thin QFN.........................................................+29C/W 48-Pin Thin QFN.........................................................+25C/W Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layer board. For detailed information on package thermal considerations, refer to Application Note 4083 at www.maxim-ic.com/thermal-tutorial. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS (V = 3V to 3.6V, T = -40C to +85C, unless otherwise noted. Typical values are at V = 3.3V, T = +25C.) CC A CC A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS OE INPUT Input High Level V 2.4 V IH1 Input Low Level V 0.5 V IL1 Input Current I V = 0 to V 24 A IN-EN IN CC DDC EN INPUT Input High Level V 2.4 V IH1 Input Low Level V 0.5 V IL1 Input Current I V = 0 to V 100 A IN-DDC IN CC HPD INPUT AND OUTPUT Input High Level V 2.4 5.3 V IH2 Input Low Level V 0.8 V IL2 Input Current I V = 0 to V 80 A IN2 IN CC HPD SNK Pulldown Resistance R 40 60 k HPD Output High Level V 2.5 V V OH-HPDB CC Output Low Level V 0 0.18 0.4 V OL-HPDB DIFFERENTIAL INPUTS (IN ) Differential Input High Threshold V V = V - V 50 mV IDH ID IN+ IN- Differential Input Low Threshold V V = V - V -50 mV IDL ID IN+ IN- Common Input Voltage V V = DC Avg (V + V ) / 2 0 1.43 2 V COM COD IN+ IN- Common-Mode AC Tolerance V V = (V + V ) / 2 - V 100 mV C M A C P- P CM AC P-P IN+ IN- COD Differential Input Termination R 40 60 IN 2 MAX9406