B0809J50ATI Anaren

Model B0809J50ATI Rev A Impedance Matched Ultra Low profile 0805 Balun for TI CC1101/1100 chipset (Anaren Application Note Ann-2005) Description The B0809J50ATI is a low cost, low profile sub-miniature unbalanced to balanced transformer specifically designed for differential inputs and output locations Texas Instruments CC1100 and CC1101 SoC Solution in an easy to use surface mount package. The B0809J50ATI is ideal for high volume manufacturing and delivers higher performance than traditional ceramic baluns. This transformation enables single ended signals to be applied to differential ports on the CC1100/CC1101. The output ports have equal amplitude (-3dB) with 180 degree phase differential. The B0809J50ATI is available on tape and reel for pick and place high volume manufacturing. Detailed Electrical Specifications: Specifications subject to change without notice. Features: ROOM (25C) 850 915 MHz Parameter Min. Typ. Max Unit Matched to TI CC1100 & Frequency 850 915 MHz CC1101 SoC 0.7mm Height Profile Unbalanced Port Impedance* 50 Low Insertion Loss Balanced Port Impedance* Matched Surface Mountable Return Loss* 15.3 18.0 dB Tape & Reel Insertion Loss** 0.5 0.6 dB Non-conductive Top Surface Power Handling 2.0 Watts RoHS Compliant Zigbee, RF4CE Halogen Free Operating Temperature -55 +85 C *Specification based on performance of unit properly installed on microstrip printed circuit boards according to Anaren application note Ann-2005. ** Insertion Loss stated at room temperature (Insertion Loss is approximately 0.1dB higher at +85C Outline Drawing TOP VIEW (Near Side) SIDE VIEW BOTTOM VIEW (Far Side) 4x 0.37 0.700.05 3 2.040.10 2 1 2x 0.15 1.290.10 6x 0.98 6x 0.22 Orientation Marker Orientation Marker 5 4 6 6x Denotes Pin Location Denotes Pin Location 0.30 4x 0.65 Pin Designation 1 GND 2 Unbalanced Port 3 GND Mechanical Outline 4 Balanced Port -Dimensions are in Millimeters 5 NC 6 Balanced Port USA/Canada: (315) 432-8909 Visit us at Toll Free: (800) 411-6596 Europe: +44 2392-232392 www.Anaren.com Asia: +86 512-62749282 Mode l B0809J50ATI Rev A Mounting Configuration: In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet published specifications. All of the Xinger components are constructed from organic PTFE based composites which possess excellent electrical and mechanical stability. Xinger components are compliant to a variety of ROHS and Green standards and ready for Pb-free soldering processes. Pads are Gold plated with a Nickel barrier. An example of the PCB footprint used in the testing of these parts is shown below. In specific designs, the transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances. 6x .41 4x .25 6x .33 .66 .04 2x Plated thru holes to 3x Transmission ground lines Circuit Pattern Footprint Pad (s) Solder Resist Dimensions are in Millimeters Mounting Footprint USA/Canada: (315) 432-8909 Visit us at Toll Free: (800) 411-6596 Europe: +44 2392-232392 www.Anaren.com Asia: +86 512-62749282