BD2425N50ATI Anaren

Model BD2425N50ATI Rev A Ultra Low Profile 0404 Balun for TI transceiver CC2500 50 to 127+j34 Balanced (Anaren Application Note Ann-2003) Description The BD2425N50ATI is a low cost, low profile sub-miniature unbalanced to balanced transformer designed for differential inputs and output locations on modern chipsets in an easy to use surface mount package. The BD2425N50ATI is ideal for high volume manufacturing and delivers higher performance than traditional ceramic baluns. The BD2425N50ATI has an unbalanced port impedance of 50 and 127+ j34 balanced port impedance. This transformation enables single ended signals to be applied to differential ports on modern integrated chipsets. The output ports have equal amplitude (-3dB) with 180 degree phase differential. The BD2425N50ATI is available on tape and reel for pick and place high volume manufacturing. Detailed Electrical Specifications: Specifications subject to change without notice. Features: ROOM (25C) 2400 2500 MHz Parameter Min. Typ. Max Unit 0.65mm Height Profile Frequency 2300 2600 MHz 50 Ohm to 2 x 63.5+j17 Ohm Low Insertion Loss Unbalanced Port Impedance** 50 Surface Mountable Balanced Port Impedance** 127+j34 Tape & Reel Return Loss** 13 17 dB Non-conductive Surface RoHS Compliant Insertion Loss* ** 0.4 0.6 dB Zigbee Power Handling 1 TBD Watts Operating Temperature -55 +85 C * Insertion Loss stated at room temperature (Insertion Loss is approximately 0.1 dB higher at +85 C) * Stated performance assumes proper matching network found in application note: ANN-2003 Outline Drawing Top View (Near-side) Side View Bottom View (Far-side) +.003 .041 .012 0.30 -.002 .0025 +.003 .024 +0.08 .041 -.002 1 1.05 -0.06 0.064 0.62 0.12 0.30 +0.08 2 1.05 -0.06 3x.010 0.25 4 3 3x.010 0.25 4X .020 0.50 Pin Designation GND / DC Feed 1 + RF GND 2 Unbalanced Port 3 Balanced Port Dimensions are in Inches Millimeters 4 Balanced Port Mechanical Outline Tolerances are Non-Cumulative Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 2392 232392 Fax: (+44) 2392 251369 Model BD2425N50ATI Rev A Mounting Configuration: In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet published specifications. All of the Xinger components are constructed from ceramic filled PTFE composites which possess excellent electrical o and mechanical stability having X and Y thermal coefficient of expansion (CTE) of 17 ppm/ C. An example of the PCB footprint used in the testing of these parts is shown below. An example of a DC-biased footprint is also shown below. In specific designs, the transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances With DC Bias 3X .011 Plated thru 0.29 hole to ground .008 0.21 3X .011 0.29 .014 0.36 .020 .008 0.21 0.50 3X Transmission .020 Line 0.50 Circuit Pattern Footprint Pad (s) Dimensions are in Inches Millimeters Solder Resist Mounting Footprint Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 2392 232392 Fax: (+44) 2392 251369