X-On Electronics has gained recognition as a prominent supplier of 75.073AR.G04 Memory Modules across the USA, India, Europe, Australia, and various other global locations. 75.073AR.G04 Memory Modules are a product manufactured by Apacer. We provide cost-effective solutions for Memory Modules, ensuring timely deliveries around the world.

75.073AR.G04 Apacer

75.073AR.G04 electronic component of Apacer
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Part No.75.073AR.G04
Manufacturer: Apacer
Category: Memory Modules
Description: Memory Modules 1G DDR2 200P 667MHz SODIMM IND TEMP
Datasheet: 75.073AR.G04 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0
MOQ : 1
Multiples : 1
1 : USD 98.5493
10 : USD 89.6951
25 : USD 89.1736
50 : USD 87.2985
100 : USD 82.1244
250 : USD 81.613
500 : USD 80.9111
1000 : USD 77.6923
N/A

Obsolete
   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Product
Memory Size
Memory Type
Speed
Operating Supply Voltage
Maximum Operating Temperature
Number of Pins
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We are delighted to provide the 75.073AR.G04 from our Memory Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the 75.073AR.G04 and other electronic components in the Memory Modules category and beyond.

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Apacer Memory Product Specification 1024MB DDR2 SDRAM SO-DIMM 1024MB DDR2 SDRAM SO-DIMM based on 128Mx8 ,8Banks, 1.8V DDR2 SDRAM with SPD Features Performance range ( Bandwidth: 5.3 GB/sec ) Part Number Max Freq. (Clock) Speed Grade 75.073AR.G04 333MHz(3ns CL5) 667Mbps JEDECstandard 1.8V 0.1V Power Supply VDDQ = 1.8V 0.1V Internal Bank: 8 Bank Posted CAS Programmable CAS Latency: 3, 4, 5 Programmable Additive Latency: 0, 1 , 2 , 3 and 4 Write Latency(WL) = Read Latency(RL) -1 Burst Length: 4 , 8(Interleave/nibble sequential) Programmable Sequential / Interleave Burst Mode Bi-directional Differential Data-Strobe (Single-ended data-strobe is an optional feature) Off-Chip Driver(OCD) Impedance Adjustment On Die Termination Refresh and Self Refresh Average Refesh Period 7.8us Serial presence detect with EEPROM Compliance with RoHS Compliance with CE Operating Temperature Rang: Commercial 0C TC 85C Industrial -40C TC 95C -40C TA 85C Refresh: auto-refresh, self-refresh Average refresh period 7.8us at 0C TC 85C 3.9us at 85C TC 95CApacer Memory Product Specification Description This module is 128M bit x 64 x1Rank Double Data Rate SDRAM high density memory modules based on first generation of 1024MB DDR2 SDRAM respectively. It consists of eight CMOS 128M x 8 bit with 8banks Double Data Rate SDRAMs in 60Ball FBGA packages mounted on a 200pin glass-epoxy substrate. Two 0.1uF decoupling capacitors are mounted on the printed circuit board in parallel for each DDR2 SDRAM. Synchronous design allows precise cycle control with the use of system clock. Data I/O transactions are possible on both edges of DQS. Range of operating frequencies, programmable latencies and burst lengths allow the same device to be useful for a variety of high bandwidth, high performance memory system applications. Industrial Temperature The industrial temperature option, if offered, has two simultaneous requirements: ambient temperature surrounding the device cannot be less than 40C or greater than +85C, and the case temperature cannot be less than 40C or greater than +95C. JEDEC specifications require the refresh rate to double when TC exceeds +85C this also requires use of the high-temperature self refresh option. Notes: MAX operating case temperature TC is measured in the center of the package Device functionality is not guaranteed if the device exceeds maximum TC during operation. Both temperature TA and TC specifications must be satisfied. Operating ambient temperature surrounding the package.

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory

8542.32.00 33 No ..Memory cards (other than ""smart"" cards and SIMM), which incorporate E2PROM, SRAM, DRAM or flash memory (for example, for PCMCIA applications)
Apacer Memory America
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