CG1206MLC-12E Bourns

Features Applications RoHS compliant* HDMI 1.4 ESD protection >25 kV Digital Visual Interface (DVI) Low capacitance <0.5 pF USB 3.0 / USB OTG Low leakage current <10 nA Memory protection SIM card ports ChipGuard CG1206MLC Series - ESD Protector Array General Information The ChipGuard CG1206MLC Series has been designed to protect sensitive electronic components from electrostatic discharge damage. The MLC family has been de- signed to protect equipment to IEC61000-4-2, Level 4 (8 kV Contact / 15 kV Air Discharge) ESD targeted for high speed USB 3.0/USB OTG, HDMI 1.4, DVI or IEEE1394 applications. The ChipGuard CG1206MLC Series has been manufactured to provide low 0.5 pF capacitance and leakage currents less than 10 nA with excellent clamp qualities, making the family almost transparent under normal working conditions. Electrical & Thermal Characteristics T = 25 C (unless otherwise noted) A Parameter Symbol CG1206MLC-12E Unit Typical Continuous Operating Voltage V 12 V DC Typical Clamping Voltage (Note 1) V 30 V C Maximum Capacitance 1 VRMS 1 MHz C 0.5 pF O Maximum Leakage Current Max. VDC I 10 nA L Typical Trigger Voltage V 150 V T Maximum Response Time R 1 ns T ESD Protection: Per IEC 61000-4-2 Level 4 Min. Contact Discharge (>100 Reps) 8 kV Min. Air Discharge (>100 Reps) 15 kV Operating Temperature T -40 to +85 C OPR Storage Temperature T -40 to +85 C STG Note 1: Per IEC 61000-4-2, 30 A 8 kV, level 4, clamp measurement made 30 ns after initiation of pulse, all tests in contact discharge mode. WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov *RoHS Directive 2015/863, Mar 31, 2015 and Annex. Specications are subject to change without notice. Users should verify actual device performance in their specic applications. The products described herein and this document are subject to specic legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. *RoHS COMPLIANT ChipGuard CG1206MLC Series - ESD Protector Array Product Dimensions Recommended Pad Layout E H D A W B D B C C MM L DIMENSIONS: (INCHES) CG1206 CG1206 Dimension Series Dim. Series 0.40 0.20 B 0.60 (0.016 0.008) A (0.024) 0.40 0.20 C 1.60 (0.016 0.008) B (0.063) 0.20 0.10 D 2.20 (0.008 0.004) C (0.087) 0.50 0.10 H 0.50 (0.019 0.004) D (0.020) 3.20 0.20 L 0.80 (0.127 0.008) E (0.03) 1.60 0.20 W (0.065 0.008) Preheat Stages 1-3 Soldering Cooling 300 A Stage 1 Preheat Ambient to Preheating 30 s to 60 s 250 Temperature B Stage 2 Preheat 140 C to 160 C 60 s to 120 s 200 C Stage 3 Preheat Preheat to 200 C 20 s to 40 s 150 D Main Heating 200 C 60 s to 70 s 210 C 55 s to 65 s 100 220 C 50 s to 60 s 230 C 40 s to 50 s 50 240 C 30 s to 40 s 0 E Cooling 200 C to 100 C 1 C/s to 4 C/s 110 sec. (min.) 120 sec. (min.) 30-70 sec. Time (seconds) This product can be damaged by rapid heating, cooling or localized heating. Heat shocks should be avoided. Preheating and gradual cooling recommended. Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. Solder gun tip temperature should be kept below 280 C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. Specications are subject to change without notice. Users should verify actual device performance in their specic applications. The products described herein and this document are subject to specic legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Temperature (C)