HCPL-5300, HCPL-5301, HCPL-530K, 1 5962-96852 Intelligent Power Module and Gate Drive Interface Hermetically Sealed Optocouplers Data Sheet Description Features The HCPL-530x devices consist of a GaAsP LED optically Performance specified over full military temperature coupled to an integrated high gain photo detector in a Range: 55C to +125C hermetically sealed package. The products are capable of Fast maximum propagation delays operation and storage over the full military temperature range t = 450 ns PHL and can be purchased as either commercial product or with full t = 650 ns PLH MIL-PRF-38534 Class Level H or K testing or from the DLA Minimized pulse width distortion (PWD = 450 ns) Standard Microcircuit Drawing (SMD) 5962-96852. All devices High common mode rejection (CMR): 10 kV/s at V = are manufactured and tested on a MIL-PRF-38534 certified line, CM 1000V and Class H and K devices are included in the DLA Qualified Manufacturers List QML-38534 for Hybrid Microcircuits. CTR > 30% at I = 10 mA F Minimized propagation delay difference between devices 1500 Vdc withstand test voltage makes these optocouplers excellent solutions for improving Manufactured and tested on a MIL-PRF-38534 certified line inverter efficiency through reduced switching dead time. An Hermetically sealed packages on-chip 20-k output pull-up resistor can be enabled by Dual marked with device part number and DLA Standard shorting output pins 6 and 7, thus eliminating the need for an Microcircuit Drawing (SMD) external pull-up resistor in common IPM applications. QML-38534, Class H and K Specifications and performance plots are given for typical IPM applications. HCPL-4506 function compatibility Applications Military and space High reliability systems Harsh industrial environments Transportation, medical, and life critical systems IPM isolation CAUTION It is advised that normal static precautions be Isolated IGBT/MOSFET gate drive taken in handling and assembly of this AC and brushless DC motor drives component to prevent damage and/or Industrial inverters degradation which may be induced by ESD. 1. See Selection GuideLead Configuration Options for available extensions. Broadcom - 1 -HCPL-5300, HCPL-5301, HCPL-530K, 5962-96852 Schematic Diagram Data Sheet Schematic Diagram Selection GuideLead Configuration Options 1 8 Part Numbers and Options 20 k : Commercial HCPL-5300 2 7 MIL-PRF-38534, Class H HCPL-5301 MIL-PRF-38534, Class K HCPL-530K 3 6 a Gold Plate Standard Lead Finish b 4 5 Option 200 Solder Dipped SHIELD a Option 100 Butt Cut/Gold Plate b Option 300 Gull Wing/Soldered Class H SMD Part Truth Table Prescript for all below 5962- a LED V 9685201HPC O Gold Plate b 9685201HPA ON L Solder Dipped a OFF H 9685201HYC Butt Cut/Gold Plate b 9685201HYA Butt Cut/Soldered NOTE The connection of a 0.1-F bypass capacitor b 9685201HXA Gull Wing/Soldered between pins 5 and 8 is recommended. Class K SMD Part Prescript for all below 5962- a 9685201KPC Gold Plate b 9685201KPA Solder Dipped a 9685201KYC Butt Cut/Gold Plate b 9685201KYA Butt Cut/Soldered b 9685201KXA Gull Wing/Soldered a. Gold Plate lead finish: Maximum gold thickness of leads is <100 micro inches. Typical is 60 to 90 micro inches. b. Solder lead finish: Sn63/Pb37. Outline Drawing 8-Pin DIP, Through Hole, 1 Channel 10.03 (0.395) 8.13 (0.320) 10.29 (0.405) MAX. 1.02 (0.040) 7.16 (0.282) 1.52 (0.060) 7.57 (0.298) 4.32 (0.170) MAX. 0.51 (0.020) 3.81 (0.150) MIN. 0.20 (0.008) MIN. 0.33 (0.013) 7.36 (0.290) 7.87 (0.310) 2.29 (0.090) 0.51 (0.020) 2.79 (0.110) MAX. NOTE: DIMENSIONS IN MILLIMETERS (INCHES). Broadcom - 2 -