TLP5701(D4-TP,E Toshiba

TLP5701 Photocouplers Infrared LED & Photo IC TLP5701TLP5701TLP5701TLP5701 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Industrial Inverters IGBT Gate Drivers MOSFET Gate Drivers Induction Cooktop and Home Appliances 2. 2. 2. 2. GeneralGeneralGeneralGeneral The TLP5701 is a photocoupler in a 6-pin SO6L package that consists of an infrared LED optically coupled to an integrated high-gain, high-speed photodetector IC chip. It provides guaranteed performance and specifications at temperature up to 110 . The TLP5701 is physically smaller / thinner than the one in an 8-pin DIP package and compliant with international safety standards for reinforced insulation. It thus provides a smaller footprint solution for applications that require safety standard certification. An internal noise shield provides a guaranteed common-mode transient immunity of 20 kV/s. The TLP5701 is ideal for small class IGBT and power MOSFET gate drive. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Buffer logic type (totem pole output) (2) Output peak current: 0.6 A (max) (3) Operating temperature: -40 to 110 (4) Supply current: 2.0 mA (max) (5) Supply voltage: 10 to 30 V (6) Threshold input current: 5 mA (max) (7) Propagation delay time: t /t = 500 ns (max) pHL pLH (8) Common-mode transient immunity: 20 kV/s (min) (9) Isolation voltage: 5000 Vrms (min) (10) Safety standards UL-recognized: UL 1577, File No.E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 (Note 1) VDE-approved: EN 60747-5-5, EN 62368-1 (Note 1)(Note 1)(Note 1) CQC-approved: GB4943.1, GB8898 Japan and Thailand Factory Option (D4) Note 1: When a VDE approved type is needed, please designate the Option (D4)Option (D4)Option (D4). Start of commercial production 2014-02 2015-2019 2019-12-05 1 Toshiba Electronic Devices & Storage Corporation Rev.6.0TLP5701 4. 4. 4. 4. Packaging (Note)Packaging (Note)Packaging (Note)Packaging (Note) TLP5701 TLP5701(LF4) 11-4N1A 11-4N101A Note: Lead-formed product: (LF4) 5. Pin Assignment 5. 5. 5. Pin AssignmentPin AssignmentPin Assignment 1: Anode 2: N.C. 3: Cathode 4: GND 5: V (Output) O 6: V CC 6. 6. 6. 6. Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note) Note: A 0.1-F bypass capacitor must be connected between pin 6 and pin 4. 2015-2019 2019-12-05 2 Toshiba Electronic Devices & Storage Corporation Rev.6.0