TLP700H(F) Toshiba

TLP700H Photocouplers Infrared LED & Photo IC TLP700HTLP700HTLP700HTLP700H 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Industrial Inverters Air Conditioner Inverters MOSFET Gate Drivers IGBT Gate Drivers Induction Cooktop and Home Appliances 2. 2. 2. 2. GeneralGeneralGeneralGeneral The TLP700H is a photocoupler in a 6-pin SDIP package that consists of an infrared LED optically coupled to an integrated high-gain, high-speed photodetector IC chip. It provides guaranteed performance and specifications at temperatures up to 125 . The TLP700H is physically smaller than the one in an 8-pin DIP package and compliant with international safety standards for reinforced insulation. It thus provides a smaller footprint solution for applications that require safety standard certification. An internal noise shield provides a guaranteed commonmode transient immunity of 20 kV/s. It is ideal for IGBT and power MOSFET gate drive. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Buffer logic type (totem pole output) (2) Output peak current: 2.5 A (max) (3) Operating temperature: -40 to 125 (4) Supply current: 3 mA (max) (5) Supply voltage: 15 to 30 V (6) Threshold input current: 5 mA (max) (7) Propagation delay time: 500 ns (max) (8) Common-mode transient immunity: 20 kV/s (min) (9) Isolation voltage: 5000 Vrms (min) (10) Safety standards UL-recognized: UL 1577, File No.E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 (Note 1) VDE-approved: EN 60747-5-5, EN 62368-1 (Note 1)(Note 1)(Note 1) Option (D4) Note 1: When a VDE approved type is needed, please designate the Option (D4)Option (D4)Option (D4). Start of commercial production 2011-05 2015-2020 2020-02-17 1 Toshiba Electronic Devices & Storage Corporation Rev.7.0TLP700H 4. 4. 4. 4. Packaging and Pin ConfigurationPackaging and Pin ConfigurationPackaging and Pin ConfigurationPackaging and Pin Configuration 1: Anode 2: N.C. 3: Cathode 4: GND 5: V (Output) O 6: V CC 11-5J1S 5. Internal Circuit (Note) 5. 5. 5. Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note) Note: A 0.1-F bypass capacitor must be connected between pin 6 and pin 4. 6. 6. 6. 6. Principle of OperationPrinciple of OperationPrinciple of OperationPrinciple of Operation 6.1. 6.1. 6.1. 6.1. Truth TableTruth TableTruth TableTruth Table Input LED M1 M2 Output H ON ON OFF H L OFF OFF ON L 6.2. 6.2. 6.2. 6.2. Mechanical ParametersMechanical ParametersMechanical ParametersMechanical Parameters 7.62 mm Pitch 10.16 mm Pitch Characteristics Unit TLP700H TLP700HF Creepage distances 7.0 (min) 8.0 (min) mm Clearance distances 7.0 (min) 8.0 (min) Internal isolation thickness 0.4 (min) 0.4 (min) 2015-2020 2020-02-17 2 Toshiba Electronic Devices & Storage Corporation Rev.7.0