2DA1797 50V PNP SURFACE MOUNT TRANSISTOR Features Mechanical Data Epitaxial Planar Die Construction Case: SOT89 Ideally Suited for Automated Assembly Processes Case Material: Molded Plastic,Green Molding Compound. UL Flammability Classification Rating 94V-0 Ideal for Medium Power Switching or Amplification Applications Moisture Sensitivity: Level 1 per J-STD-020 Complementary NPN Type Available (2DC4672) Terminals: Finish Matte Tin. Solderable per MIL-STD-202, Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2) Method 208 Halogen and Antimony Free. Green Device (Note 3) Weight: 0.052 grams (approximate) Qualified to AEC-Q101 Standards for High Reliability PPAP Capable (Note 4) SOT89 C E C C B B E Top View Top View Device symbol Pin-Out Ordering Information (Notes 4 & 5) Part Number Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel 2DA1797-13 AEC-Q101 1797 13 12 2,500 2DA1797Q-13 Automotive 1797 13 12 2,500 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See 2DA1797 Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V -50 V CBO Collector-Emitter Voltage V -50 V CEO Emitter-Base Voltage V -6 V EBO Peak Pulse Current I -6 A CM Continuous Collector Current I -3 A C Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Power Dissipation (Note 6) P 0.9 W D Thermal Resistance, Junction to Ambient Air (Note 6) 139 C/W R JA Power Dissipation (Note 7) P 2 W D Thermal Resistance, Junction to Ambient Air (Note 7) 62.5 C/W R JA Thermal Resistance, Junction to Lead (Note 8) 5.3 C/W R JL Operating and Storage Temperature Range -55 to +150 C T , T J STG ESD Ratings (Note 9) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 6. Device mounted on FR-4 PCB with minimum recommended pad layout. 2 7. Device mounted on FR-4 PCB with 1 inch copper pad layout. 8. Thermal resistance from junction to solder-point (on the exposed collector pad). 9. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 November 2013 2DA1797 Diodes Incorporated www.diodes.com Document number: DS31619 Rev. 4 - 2 NEW PRODUCT