2DB1132P/Q/R
32V PNP POWER SWITCHING TRANSISTOR IN SOT-89
Features Mechanical Data
BV > -32V Case: SOT89
CEO
Case material: molded Plastic. Green molding Compound.
I = -1A high Continuous Collector Current
C
UL Flammability Rating 94V-0
Complementary NPN Type: 2DD1664
Moisture Sensitivity: Level 1 per J-STD-020
Ideally Suited for Automated Assembly Processes
Terminals: Finish - Matte Tin Plated Leads, Solderable per
Ideal for Medium Power Switching or Amplification Applications
MIL-STD-202, Method 208
Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
Weight: 0.055 grams (Approximate)
Halogen and Antimony Free. Green Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
SOT89
C
E
B
C
C
B
E
Pin Out
Top View
Top View
Device Symbol
Ordering Information (Note 4)
Product Marking Reel size (inches) Tape width (mm) Quantity per reel
2DB1132P-13 P13P 13 12 2,500
2DB1132Q-13 P13Q 13 12 2,500
2DB1132R-13 P13R 13 12 2,500
2DB1132R-13R P13R 13 12 4,000
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See
2DB1132P/Q/R
Absolute Maximum Ratings (@T = +25C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Collector-Base Voltage V -40 V
CBO
Collector-Emitter Voltage V -32 V
CEO
Emitter-Base Voltage V -5 V
EBO
Continuous Collector Current I -1 A
C
Peak Pulse Current -2 A
I
CM
Thermal Characteristics (@T = +25C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
(Note 5) 1
Power Dissipation (Note 6) P 1.5 W
D
(Note 7) 2.0
(Note 5) 125
Thermal Resistance, Junction to Ambient Air (Note 6) R 83 C/W
JA
(Note 7) 60
Thermal Resistance, Junction to Lead (Note 8) 22 C/W
R
JL
Operating and Storage Temperature Range -55 to +150 C
T T
J, STG
ESD Ratings (Note 9)
Characteristic Symbol Value Unit JEDEC Class
Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A
Electrostatic Discharge - Machine Model ESD MM 400 V C
Notes: 5. For a device mounted with the exposed collector pad on 15mm x 15mm 1oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured
under still air conditions whilst operating in a steady-state.
6. Same as note (5), except the device is mounted on 25mm x 25mm 1oz copper.
7. Same as note (5), except the device is mounted on 50mm x 50mm 1oz copper.
8. Thermal resistance from junction to solder-point (on the exposed collector pad).
9. Refer to JEDEC specification JESD22-A114 and JESD22-A115.
2 of 6 December 2013
2DB1132P/Q/R
Diodes Incorporated
www.diodes.com
Document number: DS31142 Rev: 6 - 2