2DB1132P/Q/R 32V PNP POWER SWITCHING TRANSISTOR IN SOT-89 Features Mechanical Data BV > -32V Case: SOT89 CEO Case material: molded Plastic. Green molding Compound. I = -1A high Continuous Collector Current C UL Flammability Rating 94V-0 Complementary NPN Type: 2DD1664 Moisture Sensitivity: Level 1 per J-STD-020 Ideally Suited for Automated Assembly Processes Terminals: Finish - Matte Tin Plated Leads, Solderable per Ideal for Medium Power Switching or Amplification Applications MIL-STD-202, Method 208 Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2) Weight: 0.055 grams (Approximate) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability SOT89 C E B C C B E Pin Out Top View Top View Device Symbol Ordering Information (Note 4) Product Marking Reel size (inches) Tape width (mm) Quantity per reel 2DB1132P-13 P13P 13 12 2,500 2DB1132Q-13 P13Q 13 12 2,500 2DB1132R-13 P13R 13 12 2,500 2DB1132R-13R P13R 13 12 4,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See 2DB1132P/Q/R Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V -40 V CBO Collector-Emitter Voltage V -32 V CEO Emitter-Base Voltage V -5 V EBO Continuous Collector Current I -1 A C Peak Pulse Current -2 A I CM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 5) 1 Power Dissipation (Note 6) P 1.5 W D (Note 7) 2.0 (Note 5) 125 Thermal Resistance, Junction to Ambient Air (Note 6) R 83 C/W JA (Note 7) 60 Thermal Resistance, Junction to Lead (Note 8) 22 C/W R JL Operating and Storage Temperature Range -55 to +150 C T T J, STG ESD Ratings (Note 9) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. For a device mounted with the exposed collector pad on 15mm x 15mm 1oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 6. Same as note (5), except the device is mounted on 25mm x 25mm 1oz copper. 7. Same as note (5), except the device is mounted on 50mm x 50mm 1oz copper. 8. Thermal resistance from junction to solder-point (on the exposed collector pad). 9. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 6 December 2013 2DB1132P/Q/R Diodes Incorporated www.diodes.com Document number: DS31142 Rev: 6 - 2