AC847BQ-AC847CQ-AC848BQ NPN SMALL SIGNAL TRANSISTOR IN SOT23 Description Mechanical Data The bipolar junction transistors (BJT) are designed to meet the Case: SOT23 stringent requirements of automotive applications. Case Material: Molded Plastic, Green Molding Compound UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Features Terminals: FinishMatte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 Ideally Suited for Automatic Insertion Weight: 0.008 grams (Approximate) Complementary PNP Types: AC857BQ AC857CQ AC858BQ For Switching and AF Amplifier Applications Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free.Gree Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability PPAP Capable (Note 4) C SOT23 B E Top View Device Symbol Top View Pin-Out Ordering Information (Notes 4 & 5) Product Compliance Marking Reel Size (inches) Quantity per Reel AC847BQ-7 Automotive 2D1 7 3000 AC847CQ-7 Automotive 2C9 7 3000 AC848BQ-7 Automotive 2K9 7 3000 AC848BQ-13 Automotive 2K9 13 10,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant 2. See AC847BQ-AC847CQ-AC848BQ Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit AC847 50 Collector-Base Voltage V V CBO AC848 30 AC847 45 Collector-Emitter Voltage V V CEO AC848 30 AC847 6.0 Emitter-Base Voltage V V EBO AC848 5.0 Continuous Collector Current 100 mA I C Peak Collector Current 200 mA I CM Peak Emitter Current 200 mA I EM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 6) 310 Power Dissipation mW P D (Note 7) 350 (Note 6) 403 Thermal Resistance, Junction to Ambient C/W R JA (Note 7) 357 Thermal Resistance, Junction to Leads (Note 8) R 350 C/W JL Operating and Storage Temperature Range T T -65 to +150 C J, STG ESD Ratings (Note 9) Characteristic Symbol Value Unit JEDEC Class Electrostatic DischargeHuman Body Model ESD HBM 4000 V 3A Electrostatic DischargeMachine Model ESD MM 400 V C Notes: 6. For a device mounted on minimum recommended pad layout 1oz copper that is on a single-sided FR-4 PCB device is measured under still air conditions whilst operating in a steady-state. 7. Same as Note 6 except the device is mounted on 15mm 15mm 1oz copper. 8. Thermal resistance from junction to solder-point (at the end of the leads). 9. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 May 2019 AC847BQ-AC847CQ-AC847BQ Diodes Incorporated www.diodes.com Document number: DS39448 Rev. 3 - 2