BC56-16PA-7 Diodes Incorporated

BC56-16PA NPN MEDIUM POW ER TRANSISTOR Features Mechanical Data BV > 80V Case: U-DFN2020-3 (Type B) CEO I = 1A High Continuous Collector Current Case Material: Molded Plastic. Green Molding Compound. C I = 2A Peak Pulse Current UL Flammability Rating 94V-0 CM 520mW Power Dissipation Moisture Sensitivity: Level 1 per J-STD-020 Low Saturation Voltage V < 500mV 0.5A Terminals: Finish - Matte Tin Plated Leads. CE(sat) Complementary PNP Type: BC53-16PA Solderable per MIL-STD-202, Method 208 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Weight: 0.01 grams (Approximate) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability Applications Medium Power Switching or Amplification Applications AF Driver and Output Stages U-DFN2020-3 (Type B) C B E Top View Bottom View Device Symbol Pin-Out Ordering Information (Note 4) Product Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel BC56-16PA-7 AEC-Q101 BL 7 12 3,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See BC56-16PA Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V 100 V CBO Collector-Emitter Voltage V 80 V CEO Emitter-Base Voltage 7 V VEBO Continuous Collector Current 1 I C A Peak Pulse Collector Current 2 I CM Continuous Base Current 100 I B mA Peak Pulse Base Current 200 I BM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Power Dissipation (Note 5) P 520 mW D Thermal Resistance, Junction to Ambient (Note 5) R 240 C/W JA Thermal Resistance, Junction to Leads (Note 6) R 20 C/W JL Operating and Storage Temperature Range T T -65 to +150 C J, STG ESD Ratings (Note 7) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. For a device mounted on minimum recommended pad layout FR4 PCB single sided 1oz copper device is measured under still air conditions while operating at a steady-state. 6. Thermal resistance from junction to solder-point (at the end of the collector lead). 7. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 BC56-16PA January 2016 Diodes Incorporated www.diodes.com Datasheet Number: DS37784 Rev. 2 - 2