BC807-16/-25/-40 45V PNP SMALL SIGNAL TRANSISTOR IN SOT23 Features Mechanical Data Ideally Suited for Automatic Insertion Case: SOT23 Epitaxial Planar Die Construction Case Material: Molded Plastic, Green Molding Compound Complementary NPN Types Available (BC817) UL Flammability Classification Rating 94V-0 For switching and AF Amplifier Applications Moisture Sensitivity: Level 1 per J-STD-020 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Terminals: Finish Matte Tin Plated Leads, Solderable per Halogen and Antimony Free.Gree Device (Note 3) MIL-STD-202, Method 208 Qualified to AEC-Q101 Standards for High Reliability Weight 0.008 grams (approximate) PPAP Capable (Note 4) SOT23 C B E Top View Top View Device Symbol Pin-Out Ordering Information (Notes 5) Product Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel BC807-16-7-F AEC-Q101 K5A 7 8 3,000 BC807-25-7-F AEC-Q101 K5B 7 8 3,000 BC807-40-7-F AEC-Q101 K5C 7 8 3,000 BC807-40-13-F AEC-Q101 K5C 13 8 10,000 BC807-40Q-7-F Automotive K5C 7 8 3,000 BC807-40Q-13-F Automotive K5C 13 8 10,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See BC807-16/-25/-40 Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V -50 V CBO Collector-Emitter Voltage V -45 V CEO Emitter-Base Voltage V -5.0 V EBO Continuous Collector Current I -0.5 A C Peak Collector Current -1.0 A I CM Peak Base Current -200 mA I BM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 6) 310 Power Dissipation P mW D (Note 7) 350 (Note 6) 403 Thermal Resistance, Junction to Ambient R C/W JA (Note 7) 357 Thermal Resistance, Junction to Leads (Note 8) 350 C/W R JL Operating and Storage Temperature Range -55 to +150 C T T J, STG ESD Ratings (Note 9) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 8,000 V 3B Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 6. For the device mounted on minimum recommended pad layout FR4 PCB with high coverage of single sided 1oz copper in still air condition device measured when operating in steady state condition. 7. Same as Note 6, except the device is mounted on 15mm X 15mm FR4 PCB. 8. Thermal resistance from junction to solder-point (at the end of the leads). 9. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 October 2013 BC807-16/-25/-40 Diodes Incorporated www.diodes.com Document Number: DS11208 Rev. 19 - 2