BC847BFAQ 45V NPN SMALL SIGNAL TRANSISTOR IN DFN0806 Description Mechanical Data Case: X2-DFN0806-3 This Bipolar Junction Transistor (BJT) is designed to meet the stringent Case Material: Molded Plastic, Green Molding Compound. requirements of Automotive Applications. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Features Terminals: Finish NiPdAu, Solderable per MIL-STD-202, e4 Method 208 BV > 45V CEO Weight: 0.0008 grams (Approximate) I = 100mA High Collector Current C P = 435mW Power Dissipation D 2 0.48mm Package Footprint, 16 Times Smaller than SOT23 0.4mm Height Package Minimizing Off-Board Profile Complementary PNP Type BC857BFA Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability PPAP Capable (Note 4) X2-DFN0806-3 C B B C E E Top View Device Symbol Bottom View Top View Device Schematic Ordering Information (Notes 4 & 5) Product Compliance Marking Reel Size (inches) Tape Width (mm) Quantity per Reel BC847BFAQ-7B Automotive 1F 7 8mm 10,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See BC847BFAQ Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage 50 V VCBO Collector-Emitter Voltage 45 V V CEO Emitter-Base Voltage 6.0 V V EBO Continuous Collector Current 100 mA I C Peak Pulse Collector Current 200 mA I CM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Power Dissipation (Note 6) 435 mW P D Thermal Resistance, Junction to Ambient (Note 6) 287 C/W R JA Thermal Resistance, Junction to Lead (Note 8) 150 C/W R JL Operating and Storage and Temperature Range T , T -55 to +150 C J STG ESD Ratings (Note 8) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge Machine Model ESD MM 200 V B Notes: 6. For the device mounted on minimum recommended pad layout 1oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in steady state condition. The entire exposed collector pad is attached to the heatsink. 7. Thermal resistance from junction to solder-point (on the exposed collector pad). 8. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 BC847BFAQ May 2016 Diodes Incorporated www.diodes.com Document number: DS38755 Rev. 1 - 2