BC857BFZ 45V PNP SMALL SIGNAL TRANSISTOR IN DFN0606 Features Mechanical Data BV > -45V CEO Case: X2-DFN0606-3 I = -100mA High Collector Current C Case Material: Molded Plastic, Green Molding Compound. P = 925mW Power Dissipation D UL Flammability Classification Rating 94V-0 2 0.36mm Package Footprint, 40% Smaller than DFN1006 Moisture Sensitivity: Level 1 per J-STD-020 0.4mm Height Package Minimizing Off-Board Profile Terminals: Finish NiPdAu, Solderable per MIL-STD-202, e4 Complementary NPN Type BC847BFZ Method 208 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Weight: 0.0008 grams (Approximate) Halogen and Antimony Free. Green Device (Note 3) C X2-DFN0606-3 B E Top View Device Schematic Device Symbol Top View Bottom View Ordering Information (Note 4) Product Marking Reel size (inches) Tape width (mm) Quantity per reel BC857BFZ-7B 3W 7 8 10,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See BC857BFZ Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V -50 V CBO Collector-Emitter Voltage V -45 V CEO Emitter-Base Voltage V -6.0 V EBO Continuous Collector Current -100 mA I C Peak Pulse Collector Current -200 mA I CM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 5) 270 Power Dissipation P mW D (Note 6) 925 (Note 5) 465 Thermal Resistance, Junction to Ambient R C/W JA (Note 6) 135 Thermal Resistance, Junction to Lead (Note 7) 135 C/W R JL Operating and Storage and Temperature Range T , T -55 to +150 C J STG ESD Ratings (Note 8) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 200 V B Notes: 5. For the device mounted on minimum recommended pad layout 1oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in steady state condition. The entire exposed collector pad is attached to the heatsink. 6. Same as Note 5, except the exposed collector pad is mounted on 25mm x 25mm 2oz copper. 7. Thermal resistance from junction to solder-point (on the exposed collector pad). 8. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 BC857BFZ May 2015 Diodes Incorporated www.diodes.com Document number: DS37158 Rev. 2 - 2 NEW PRODUCT