BCV47QTA Diodes Incorporated

BCV47Q 60V NPN DARLINGTON TRANSISTOR IN SOT23 Description Mechanical Data This Bipolar Junction Transistor (BJT) is designed to meet the Case: SOT23 stringent requirements of automotive applications. Case Material: Molded Plastic, Green molding compound UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Features Terminals: Finish Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 BV > 60V CEO Weight 0.008 grams (Approximate) Darlington Transistor h > 10k 100mA for High Gain FE I = 500mA High Continuous Collector Current C Complementary Darlington PNP Type: BCV46 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability PPAP Capable (Note 4) SOT23 E C B Top View Device Symbol Top View Pin-Out Ordering Information (Notes 4 & 5) Part Number Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel BCV47QTA Automotive ZFG 7 8 3,000 BCV47QTC Automotive ZFG 13 8 10,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See BCV47Q Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V 80 V CBO Collector-Emitter Voltage V 60 V CEO Emitter-Base Voltage 10 V V EBO Continuous Collector Current 500 mA I C Peak Pulse Current 800 mA I CM Base Current 100 mA I B Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 6) 310 Power Dissipation mW PD (Note 7) 350 (Note 6) 403 Thermal Resistance, Junction to Ambient R C/W JA (Note 7) 357 Thermal Resistance, Junction to Leads (Note 8) 350 C/W R JL Operating and Storage Temperature Range -55 to +150 C T T J, STG ESD Ratings (Note 9) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 2,000 V 2 Electrostatic Discharge - Machine Model ESD MM 200 V B Notes: 6. For the device mounted on minimum recommended pad layout FR4 PCB with high coverage of single sided 1oz copper in still air condition the device is measured when operating in a steady-state condition. 7. Same as note (6), except the device is mounted on 15mm x 15mm FR4 PCB. 8. Thermal resistance from junction to solder-point (at the end of the leads). 9. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 BCV47Q November 2017 Diodes Incorporated www.diodes.com Document number: DS39807 Rev. 1 - 2