A Product Line of Diodes Incorporated BCV47 60V NPN DARLINGTON TRANSISTOR IN SOT23 Features Mechanical Data BV > 60V Case: SOT23 CEO Darlington Transistor h > 10k 100mA for high gain Case Material: molded plastic, Green molding compound FE I = 500mA high Continuous Collector Current UL Flammability Classification Rating 94V-0 C Complementary Darlington PNP Type: BCV46 Moisture Sensitivity: Level 1 per J-STD-020 Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2) Terminals: Finish Matte Tin Plated Leads, Solderable per Halogen and Antimony Free. Green Device (Note 3) MIL-STD-202, Method 208 Qualified to AEC-Q101 Standards for High Reliability Weight 0.008 grams (approximate) PPAP capable (Note 4) C SOT23 E B C B E Top View Device Symbol Top View Pin-Out Ordering Information (Notes 4 & 5) Part Number Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel BCV47TA AEC-Q101 ZFG 7 8 3,000 BCV47TC AEC-Q101 ZFG 13 8 10,000 BCV47QTA Automotive ZFG 7 8 3,000 BCV47QTC Automotive ZFG 13 8 10,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See A Product Line of Diodes Incorporated BCV47 Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V 80 V CBO Collector-Emitter Voltage 60 V V CEO Emitter-Base Voltage 10 V V EBO Continuous Collector Current 500 mA I C Peak Pulse Current 800 mA I CM Base Current I 100 mA B Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 6) 310 Power Dissipation mW P D (Note 7) 350 (Note 6) 403 Thermal Resistance, Junction to Ambient R C/W JA (Note 7) 357 Thermal Resistance, Junction to Leads (Note 8) R 350 C/W JL Operating and Storage Temperature Range T T -55 to +150 C J, STG Notes: 6. For the device mounted on minimum recommended pad layout FR4 PCB with high coverage of single sided 1oz copper in still air condition the device is measured when operating in a steady-state condition. 7. Same as note (6), except the device is mounted on 15mm x 15mm FR4 PCB. 8. Thermal resistance from junction to solder-point (at the end of the leads). 0.4 400 350 0.3 300 250 D=0.5 0.2 200 150 D=0.1 Single Pulse D=0.2 0.1 100 50 D=0.05 0.0 0 0 255075 100 125 150 100 1m 10m 100m 1 10 100 1k Pulse Width (s) Temperature (C) Transient Thermal Impedance Derating Curve 10 Single Pulse. T =25C amb 1 0.1 10m 100m 1 10 100 1k Pulse Width (s) Pulse Power Dissipation 2 of 5 December 2012 BCV47 Diodes Incorporated www.diodes.com Document number: DS33001 Rev. 4 - 2 Max Power Dissipation (W) Max Power Dissipation (W) Thermal Resistance (C/W)