BCX5616Q 80V NPN MEDIUM POWER TRANSI STORS IN SOT89 Description Mechanical Data This Bipolar Junction Transistor (BJT) is designed to meet the Case: SOT89 stringent requirements of Automotive Applications. Case Material: Molded Plastic, Green Molding Compound UL Flammability Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Matte Tin Finish Leads, Solderable per MIL-STD-202 Method 208 Weight: 0.055 grams (Approximate) Features Applications BV > 80V Automotive CEO I = 1A High Continuous Collector Current Medium Power Switching or Amplification Applications c I = 2.0A Peak Pulse Current AF Driver and Output Stages CM Low Saturation Voltage V < 500mV 0.5A CE(sat) Epitaxial Planar Die Construction Complementary PNP types: BCX5316Q Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen- and Antimony-Free. Green Device (Note 3) The BCX5616Q is suitable for automotive applications requiring specific change control this part is AEC-Q101 qualified, PPAP capable, and manufactured in IATF16949 certified facilities. BCX5616Q Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V 100 V CBO Collector-Emitter Voltage 80 V VCEO Emitter-Base Voltage 6 V V EBO Continuous Collector Current 1 I C A Peak Pulse Collector Current 2.0 I CM Continuous Base Current 100 I B mA Peak Pulse Base Current I 200 BM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 5) 1 Power Dissipation (Note 6) P 1.5 W D (Note 7) 2.0 (Note 5) 125 Thermal Resistance, Junction to Ambient Air (Note 6) 83 C/W R JA (Note 7) 60 Thermal Resistance, Junction to Lead (Note 8) R 13 C/W JL Operating and Storage Temperature Range T T -55 to +150 C J, STG ESD Ratings (Note 9) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. For a device mounted with the exposed collector pad on 15mm x 15mm 1oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 6. Same as note (6), except the device is mounted on 25mm x 25mm 1oz copper. 7. Same as note (6), except the device is mounted on 50mm x 50mm 1oz copper. 8. Thermal resistance from junction to solder-point (on the exposed collector pad). 9. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 November 2020 BCX5616Q Diodes Incorporated www.diodes.com Datasheet number: DS37024 Rev. 3 2