A Product Line of Diodes Incorporated BSR43 80V NPN MEDIUM POWER TRANSISTOR IN SOT89 Features Mechanical Data BV > 80V Case: SOT89 CEO I = -1A High Continuous Current Case Material: Molded Plastic, Green Molding Compound C Low saturation voltage V < 250mV 150mA UL Flammability Rating 94V-0 CE(sat) Complementary type BSR33 Moisture Sensitivity: Level 1 per J-STD-020 Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2) Terminals: Matte Tin Finish, Solderable per MIL-STD-202, Halogen and Antimony Free. Green Device (Note 3) Method 208 Qualified to AEC-Q101 Standards for High Reliability Weight: 0.052 grams (Approximate) PPAP capable (Note 4) Application Load management functions Solenoid, relay and actuator drivers DC DC modules C SOT89 E B C C B E Top View Device Symbol Top View Pin-Out Ordering Information (Notes 4 & 5) Product Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel BSR43TA AEC-Q101 AR4 7 12 1,000 BSR43QTA Automotive AR4 7 12 1,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See A Product Line of Diodes Incorporated BSR43 Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V 90 V CBO Collector-Emitter Voltage V 80 V CEO Emitter-Base Voltage 5 V V EBO Continuous Collector Current 1 A I C Peak Pulse Current 2 A I CM Peak Base Current I 200 mA BM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 6) 1 Power Dissipation (Note 7) 1.5 P W D (Note 8) 2.1 (Note 6) 125 Thermal Resistance, Junction to Ambient Air (Note 7) 83 C/W R JA (Note 8) 60 Thermal Resistance, Junction to Lead (Note 9) R 13 C/W JL Operating and Storage Temperature Range T T -65 to +150 C J, STG ESD Ratings (Note 9) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 6. For a device mounted with the exposed collector pad on 15mm x 15mm 1oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 7. Same as note (5), except the device is mounted on 25mm x 25mm 1oz copper. 8. Same as note (5), except the device is mounted on 50mm x 50mm 1oz copper. 9. Thermal resistance from junction to solder-point (on the exposed collector pad). 10. Refer to JEDEC specification JESD22-A114 and JESD22-A115. BSR43 2 of 7 November 2013 Diodes Incorporated Datasheet Number: DS33018 Rev. 5 - 2 www.diodes.com