A Product Line of Diodes Incorporated BST39 350V NPN HIGH VOLTAGE TRANSISTOR IN SOT89 Features Mechanical Data BV > 350V CEO Case: SOT89 I = 0.5A High Continuous Current C Case Material: Molded Plastic, Green Molding Compound I = 1A Peak Pulse Current CM UL Flammability Rating 94V-0 High H Hold Up FE Moisture Sensitivity: Level 1 per J-STD-020 Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2) Terminals: Finish - Matte Tin Plated Leads, Solderable per Halogen and Antimony Free. Green Device (Note 3) MIL-STD-202, Method 208 Qualified to AEC-Q101 Standards for High Reliability Weight: 0.072 grams (Approximate) C SOT89 E B C C B E Top View Device Symbol Top View Pin-Out Ordering Information (Note 4) Part Number Marking Reel size (inches) Tape width (mm) Quantity per reel BST39TA AT1 7 12 1,000 BST39-13R AT1 13 12 4,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See A Product Line of Diodes Incorporated BST39 Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage 400 V V CBO Collector-Emitter Voltage 350 V V CEO Emitter-Base Voltage 7 V V EBO Continuous Collector Current 500 mA I C Peak Pulse Current I 1 A CM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 5) 1 Power Dissipation (Note 6) 1.5 W P D (Note 7) 2.0 (Note 5) 125 Thermal Resistance, Junction to Ambient Air (Note 6) 83 R JA (Note 7) 60 C/W Thermal Resistance, Junction to Lead (Note 8) R 22 JL Thermal Resistance, Junction to Case (Note 9) R 16 JC Operating and Storage Temperature Range T T -55 to +150 C J, STG ESD Ratings (Note 10) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. For a device mounted with the exposed collector pad on 15mm x 15mm 1oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 6. Same as Note 5, except the device is mounted on 25mm x 25mm 1oz copper. 7. Same as Note 5, except the device is mounted on 50mm x 50mm 1oz copper. 8. Thermal resistance from junction to solder-point (on the exposed collector pad). 9. Thermal resistance from junction to the top of the case. 10. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 July 2014 BST39 Diodes Incorporated www.diodes.com Document number: DS33021 Rev. 5 - 2