X-On Electronics has gained recognition as a prominent supplier of DMP2010UFG-7 MOSFETs across the USA, India, Europe, Australia, and various other global locations. DMP2010UFG-7 MOSFETs are a product manufactured by Diodes Incorporated. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

DMP2010UFG-7 Diodes Incorporated

DMP2010UFG-7 electronic component of Diodes Incorporated
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See Product Specifications
Part No.DMP2010UFG-7
Manufacturer: Diodes Incorporated
Category: MOSFETs
Description: MOSFET 20V P-Ch Enh FET 10Vgss -80A Idm
Datasheet: DMP2010UFG-7 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 1.045 ea
Line Total: USD 1.04 
Availability - 2269
Ship by Thu. 28 Nov to Mon. 02 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2269
Ship by Thu. 28 Nov to Mon. 02 Dec
MOQ : 1
Multiples : 1
1 : USD 1.045
10 : USD 0.7051
100 : USD 0.4873
500 : USD 0.3894
1000 : USD 0.3575
2000 : USD 0.3465

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Configuration
Series
Brand
Fall Time
Product Type
Rise Time
Factory Pack Quantity :
Subcategory
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
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We are delighted to provide the DMP2010UFG-7 from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the DMP2010UFG-7 and other electronic components in the MOSFETs category and beyond.

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DMP2010UFG 20V P-CHANNEL ENHANCEMENT MODE MOSFET POWERDI Product Summary Features I Max Low R Ensures On State Losses Are Minimized D DS(ON) V R Max (BR)DSS DS(ON) T = +25C Small Form Factor Thermally Efficient Package Enables Higher C Density End Products 9.5m @ V = -4.5V GS -20V -42A Occupies Just 33% of The Board Area Occupied by SO-8 12.5m @ V = -2.5V GS Enabling Smaller End Product Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) Description This MOSFET is designed to minimize the on-state resistance (R ), yet maintain superior switching performance, making it DS(ON) Mechanical Data ideal for high efficiency power management applications. Case: POWERDI 3333-8 Case Material: Molded Plastic,Gree Molding Compound. UL Flammability Classification Rating 94V-0 Applications Moisture Sensitivity: Level 1 per J-STD-020 Load Switch Terminal Connections Indicator: See Diagram Power Management Functions Terminals: Finish Matte Tin Annealed over Copper Leadframe. Solderable per MIL-STD-202, Method 208 Weight: 0.008 grams (Approximate) POWERDI 3333-8 D Pin 1 S S S G G D D D S D Equivalent Circuit Top View Bottom View Ordering Information (Note 4) Part Number Case Packaging DMP2010UFG-7 POWERDI 3333-8 2000/Tape & Reel DMP2010UFG-13 POWERDI 3333-8 3000/Tape & Reel Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See DMP2010UFG Maximum Ratings (@T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Drain-Source Voltage V -20 V DSS Gate-Source Voltage V 10 V GSS T = +25C -12.7 A Continuous Drain Current, V = -4.5V (Note 6) I A GS D -42 T = +25C C Maximum Continuous Body Diode Forward Current (Note 6) -3 A I S Pulsed Drain Current (380s Pulse, Duty Cycle = 1%) -80 A I DM Avalanche Current, L=0.1mH (Note 7) -35 A I AS Avalanche Energy, L=0.1mH (Note 7) E 64 mJ AS Thermal Characteristics (@T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Total Power Dissipation (Note 5) P 0.9 W D Steady State Thermal Resistance, Junction to Ambient (Note 5) 136 C/W R JA Total Power Dissipation (Note 6) P 2.3 W D Steady State Thermal Resistance, Junction to Ambient (Note 6) 54 R JA C/W Thermal Resistance, Junction to Case (Note 6) 4 R JC Operating and Storage Temperature Range -55 to +150 C T T J, STG Electrical Characteristics (@T = +25C, unless otherwise specified.) A Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 8) Drain-Source Breakdown Voltage -20 V BV V = 0V, I = -1mA DSS GS D Zero Gate Voltage Drain Current -1 A I V = -16V, V = 0V DSS DS GS Gate-Source Leakage 100 nA I V = 8V, V = 0V GSS GS DS ON CHARACTERISTICS (Note 8) Gate Threshold Voltage V -0.4 -1.2 V V = V , I = -250A GS(TH) DS GS D 9.5 V = -4.5V, I = -3.6A GS D Static Drain-Source On-Resistance m R DS(ON) 12.5 V = -2.5V, I = -3.6A GS D Diode Forward Voltage V -0.7 -1.2 V V = 0V, I = -10A SD GS S DYNAMIC CHARACTERISTICS (Note 9) 3350 Input Capacitance C iss V = -10V, V = 0V DS GS 527 Output Capacitance C pF oss f = 1.0MHz Reverse Transfer Capacitance 460 C rss Gate Resistance 10.7 R V = 0V, V = 0V, f = 1.0MHz G DS GS 50 Total Gate Charge (V = -4.5V) Q GS g 103 Total Gate Charge (V = -10V) Q GS g nC V = -10V, I = -3.6A DS D Gate-Source Charge 6.0 Q gs 14.4 Gate-Drain Charge Q gd 9.7 Turn-On Delay Time t D(ON) 30 Turn-On Rise Time t R V = -10V, V = -4.5V, DD GS ns 235 Turn-Off Delay Time t R = 4.7, I = -3.6A D(OFF) GEN D 110 Turn-Off Fall Time t F Reverse Recovery Time 64 ns t RR I = -3.6A, di/dt = 100A/s F Reverse Recovery Charge 60 nC Q RR Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout. 6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate. 7. IAS and EAS ratings are based on low frequency and duty cycles to keep TJ = +25C. 8. Short duration pulse test used to minimize self-heating effect. 9. Guaranteed by design. Not subject to product testing. POWERDI is a registered trademark of Diodes Incorporated. 2 of 7 DMP2010UFG September 2015 Diodes Incorporated www.diodes.com Document number: DS37848 Rev. 2 - 2 ADVANCE INFORMATION ADVANCE INFORMATION NEW PRODUCT

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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