DMP4025LK3 40V P-CHANNEL ENHANCEMENT MODE MOSFET Product Summary Features I max Low On-Resistance D BV R max DSS DS(on) T = +25C Fast Switching Speed A (Note 6) Low Input/Output Leakage 25m V = -10V -8.6A GS Lead-Free Finish RoHS compliant (Note 1 & 2) -40V 45m V = -4.5V -7.0A Halogen and Antimony Free. Green Device (Note 3) GS Qualified to AEC-Q101 Standards for High Reliability Description Mechanical Data This MOSFET has been designed to minimize the on-state resistance Case: TO252 (DPAK) and yet maintain superior switching performance, making it ideal for Case Material: Molded Plastic, Green Molding Compound. UL high efficiency power management applications. Flammability Classification Rating 94V-0 (Note 1) Moisture Sensitivity: Level 1 per J-STD-020 Applications Terminals Connections: See diagram below Terminals: Finish - Matte Tin annealed over Copper lead frame. Motor control Solderable per MIL-STD-202, Method 208 Backlighting Weight: 0.315 grams (approximate) DC-DC Converters Printer equipment TO252 Top View Top View Device symbol Pin Out Ordering Information (Note 4) Product Marking Reel size (inches) Tape width (mm) Quantity per reel DMP4025LK3-13 P4025L 13 16 2,500 Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See DMP4025LK3 Maximum Ratings ( T = +25C unless otherwise specified.) A Characteristic Symbol Value Units Drain-Source Voltage V -40 DSS V Gate-Source Voltage V 20 GSS (Notes 6) -8.6 Continuous Drain Current V = -10V T = +70C (Notes 6) I -6.9 GS A D (Notes 5) -6.7 A Pulsed Drain Current V = -10V (Notes 7) I -35 GS DM Continuous Source Current (Body diode) (Notes 7) I -8.6 S Pulsed Source Current (Body diode) (Notes 7) I -35 SM Thermal Characteristics ( T = +25C unless otherwise specified.) A Characteristic Symbol Value Unit (Notes 5) 1.7 Power Dissipation W P D (Notes 6) 2.78 (Notes 5) 74 Thermal Resistance, Junction to Ambient R JA (Notes 6) 45 C/W Thermal Resistance, Junction to Case (Notes 6) R 7.1 JC Thermal Resistance, Junction to Lead (Notes 8) R 1.43 JL Operating and Storage Temperature Range T T -55 to +150 C J, STG Notes: 5. For a device surface mounted on minimum recommended FR4 PCB with high coverage of single sided 1oz copper, in still air conditions the device is measured when operating in a steady-state condition. 6. Same as note (5), except the device is surface mounted on 25mm X 25mm X 1.6mm FR4 PCB. 7. Repetitive rating on 25mm X 25mm FR4 PCB, D=0.02, pulse width 300s pulse width by maximum junction temperature. 8. Thermal resistance from junction to solder-point (at the end of the drain lead). 2 of 8 March 2014 DMP4025LK3 Diodes Incorporated www.diodes.com Document Number:35938 Rev. 3 - 2 ADVANCE INFORMATION