A Product Line of Diodes Incorporated DMP4025LSS 40V P-CHANNEL ENHANCEMENT MODE MOSFET Product Summary Features and Benefits Low R Minimizes conduction losses DS(on) I max (A) D Fast switching speed Minimizes switching losses V R max (BR)DSS DS(on) T = 25C A Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2) (Notes 6) Halogen and Antimony Free. Green Device (Note 3) 25m V = -10V -8.0 GS Qualified to AEC-Q101 Standards for High Reliability -40V 45m V = -4.5V -6.0 GS Mechanical Data Description and Applications Case: SO-8 This MOSFET has been designed to minimize the on-state resistance and yet maintain superior switching performance, making it ideal for Case Material: Molded Plastic, Green Molding Compound. UL high efficiency power management applications. Flammability Classification Rating 94V-0 (Note 1) Moisture Sensitivity: Level 1 per J-STD-020 Motor control Terminals: Finish - Matte Tin annealed over Copper lead frame. Backlighting Solderable per MIL-STD-202, Method 208 Weight: 0.074 grams (approximate) DC-DC Converters Printer equipment SO-8 Pin-Out Top View Device symbol Top View Ordering Information (Note 4) Product Marking Reel size (inches) Tape width (mm) Quantity per reel DMP4025LSS-13 P4025LS 13 12 2,500 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See A Product Line of Diodes Incorporated DMP4025LSS Maximum Ratings T = 25C unless otherwise specified A Characteristic Symbol Value Units Drain-Source Voltage -40 V DSS V Gate-Source Voltage V 20 GSS (Notes 6) -8.0 Continuous Drain Current V = -10V T = 70C (Notes 6) I -6.9 GS A D (Notes 5) -6.0 A Pulsed Drain Current V = -10V (Notes 7) I -30 GS DM Continuous Source Current (Body diode) (Notes 7) I -8.0 S Pulsed Source Current (Body diode) (Notes 7) I -30 SM Thermal Characteristics T = 25C unless otherwise specified A Characteristic Symbol Value Unit (Notes 5) 1.52 Power Dissipation W P D (Notes 6) 2.4 (Notes 5) 82 Thermal Resistance, Junction to Ambient R JA (Notes 6) 52 C/W Thermal Resistance, Junction to Lead (Notes 8) 48.85 R JL Operating and Storage Temperature Range T T -55 to +150 C J, STG Notes: 5. For a device surface mounted on minimum recommended FR4 PCB with high coverage of single sided 1oz copper, in still air conditions the device is measured when operating in a steady-state condition. 6. Same as note (2), except the device is surface mounted on 25mm X 25mm X 1.6mm FR4 PCB. 7. Repetitive rating on 25mm X 25mm FR4 PCB, D=0.02, pulse width 300s pulse width by maximum junction temperature. 8. Thermal resistance from junction to solder-point (at the end of the drain lead). 2 of 8 June 2012 DMP4025LSD Diodes Incorporated www.diodes.com Document Number: DS35936 Rev: 1 - 2 ADVANCE INFORMATION