X-On Electronics has gained recognition as a prominent supplier of DMP6023LFGQ-7 MOSFETs across the USA, India, Europe, Australia, and various other global locations. DMP6023LFGQ-7 MOSFETs are a product manufactured by Diodes Incorporated. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

DMP6023LFGQ-7 Diodes Incorporated

DMP6023LFGQ-7 electronic component of Diodes Incorporated
DMP6023LFGQ-7 Diodes Incorporated
DMP6023LFGQ-7 MOSFETs
DMP6023LFGQ-7  Semiconductors

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See Product Specifications
Part No. DMP6023LFGQ-7
Manufacturer: Diodes Incorporated
Category: MOSFETs
Description: MOSFET MOSFET BVDSS: 41V-60V
Datasheet: DMP6023LFGQ-7 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 0.792 ea
Line Total: USD 0.79 
Availability - 33030
Ship by Fri. 24 Jan to Tue. 28 Jan
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2124
Ship by Tue. 04 Feb to Fri. 07 Feb
MOQ : 1
Multiples : 1
1 : USD 0.5549
10 : USD 0.4546
30 : USD 0.4046
100 : USD 0.3669
500 : USD 0.337
1000 : USD 0.322

33030
Ship by Fri. 24 Jan to Tue. 28 Jan
MOQ : 1
Multiples : 1
1 : USD 0.792
10 : USD 0.6457
100 : USD 0.4455
500 : USD 0.3553
1000 : USD 0.3245
2000 : USD 0.2706
24000 : USD 0.264

   
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We are delighted to provide the DMP6023LFGQ-7 from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the DMP6023LFGQ-7 and other electronic components in the MOSFETs category and beyond.

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DMP6023LFGQ 60V P-CHANNEL ENHANCEMENT MODE MOSFET POWERDI Product Summary Features and Benefits Low R ensures on state losses are minimized DS(ON) I max D V R max (BR)DSS DS(ON) Small form factor thermally efficient package enables higher T = +25C A density end products 25m V = -10V GS -7.7A -60V Occupies just 33% of the board area occupied by SO-8 enabling 33m V = -4.5V -6.8A GS smaller end product Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability PPAP Capable (Note 4) Description and Applications Mechanical Data This MOSFET is designed to meet the stringent requirements of Case: POWERDI 3333-8 automotive applications. It is qualified to AECQ101, supported by a Case Material: Molded Plastic,Gree Molding Compound. PPAP and is ideal for use in: UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Backlighting Terminal Connections Indicator: See Diagram Power Management Functions Terminals: Finish Matte Tin Annealed over Copper Leadframe. DC-DC Converters Solderable per MIL-STD-202, Method 208 Weight: 0.072 grams (Approximate) POWERDI 3333-8 D Pin 1 S S S G G D D D D S Bottom View Top View Equivalent Circuit Ordering Information (Note 5) Part Number Case Packaging DMP6023LFGQ-7 2,000/Tape & Reel POWERDI 3333-8 DMP6023LFGQ-13 3,000/Tape & Reel POWERDI 3333-8 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See DMP6023LFGQ Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Units Drain-Source Voltage V -60 V DSS Gate-Source Voltage V 20 V GSS Steady T = +25C -7.7 A I A D State -6.2 T = +70C A Continuous Drain Current (Note 7) V = -10V GS T = +25C -10.3 A t<10s A I D -8.2 T = +70C A Pulsed Drain Current (10s pulse, duty cycle = 1%) I -55 A DM Maximum Continuous Body Diode Forward Current (Note 6) I -2.2 A S Avalanche Current, L = 0.1mH I -35.5 A AS Avalanche Energy, L = 0.1mH E 62.9 mJ AS Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Units Total Power Dissipation (Note 6) 1.0 W P D Steady State 123 Thermal Resistance, Junction to Ambient (Note 6) C/W R JA t<10s 69 Total Power Dissipation (Note 7) 2.1 W P D Steady State 60 Thermal Resistance, Junction to Ambient (Note 7) R JA t<10s 34 C/W Thermal Resistance, Junction to Case (Note 7) R 6.3 JC Operating and Storage Temperature Range -55 to +150 C T T J, STG Electrical Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 8) Drain-Source Breakdown Voltage -60 V BV V = 0V, I = -250A DSS GS D -1 A Zero Gate Voltage Drain Current T = +25C I V = -60V, V = 0V J DSS DS GS Gate-Source Leakage I 100 nA V = 20V, V = 0V GSS GS DS ON CHARACTERISTICS (Note 8) Gate Threshold Voltage V -1 -3 V V = V , I = -250A GS(TH) DS GS D 25 V = -10V, I = -5A GS D Static Drain-Source On-Resistance m R DS(ON) 33 V = -4.5V, I = -4A GS D Diode Forward Voltage V -0.7 -1.2 V V = 0V, I = -1A SD GS S DYNAMIC CHARACTERISTICS (Note 9) Input Capacitance C pF iss 2569 V = -30V, V = 0V, DS GS Output Capacitance pF C 179 oss f = 1MHz Reverse Transfer Capacitance pF C 143 rss Gate Resistance 8 R V = 0V, V = 0V, f = 1MHz g DS GS 26.5 nC Total Gate Charge (V = -4.5V) Q GS g 53.1 nC Total Gate Charge (V = -10V) Q GS g V = -30V, I = -5A DS D 7.1 Gate-Source Charge Q nC gs 12.6 Gate-Drain Charge Q nC gd 6 Turn-On Delay Time t ns D(ON) 7.1 Turn-On Rise Time t ns R V = -10V, V = -30V, GS DS 110 Turn-Off Delay Time t ns R = 3, I = -5A D(OFF) G D Turn-Off Fall Time 62 ns t F Body Diode Reverse Recovery Time 20 ns t RR I = -5A, di/dt = 100A/s F Body Diode Reverse Recovery Charge 14 nC Q RR Notes: 6. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided. 7. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1-inch square copper plate. 8. Short duration pulse test used to minimize self-heating effect. 9. Guaranteed by design. Not subject to product testing. POWERDI is a registered trademark of Diodes Incorporated. 2 of 7 DMP6023LFGQ March 2016 Diodes Incorporated www.diodes.com Document number: DS38647 Rev. 1 - 2 ADVANCE INFORMATION

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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