X-On Electronics has gained recognition as a prominent supplier of DMT3006LFG-7 MOSFETs across the USA, India, Europe, Australia, and various other global locations. DMT3006LFG-7 MOSFETs are a product manufactured by Diodes Incorporated. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

DMT3006LFG-7 Diodes Incorporated

DMT3006LFG-7 electronic component of Diodes Incorporated
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Part No.DMT3006LFG-7
Manufacturer: Diodes Incorporated
Category: MOSFETs
Description: MOSFET MOSFET BVDSS: 25V-30V
Datasheet: DMT3006LFG-7 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
2000: USD 0.5746 ea
Line Total: USD 1149.2 
Availability - 0
MOQ: 2000  Multiples: 2000
Pack Size: 2000
Availability Price Quantity
0
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ : 2000
Multiples : 2000
2000 : USD 0.5746
4000 : USD 0.5726
6000 : USD 0.5705
10000 : USD 0.5685
20000 : USD 0.5663
24000 : USD 0.5643
30000 : USD 0.5622
50000 : USD 0.5599
100000 : USD 0.5577

0
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ : 2000
Multiples : 2000
2000 : USD 0.3417

0
Ship by Wed. 25 Dec to Fri. 27 Dec
MOQ : 1
Multiples : 1
1 : USD 0.9882
10 : USD 0.8442
100 : USD 0.6229
500 : USD 0.4927
1000 : USD 0.3784
2000 : USD 0.3423
4000 : USD 0.3378

   
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We are delighted to provide the DMT3006LFG-7 from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the DMT3006LFG-7 and other electronic components in the MOSFETs category and beyond.

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DMT3006LFG Green N-CHANNEL ENHANCEMENT MODE MOSFET PowerDI3333-8 Product Summary Features and Benefits I Max Low R Ensures On-State Losses are Minimized D DS(ON) BV R Max DSS DS(ON) T = +25C Excellent Q R Product (FOM) C GD DS(ON) Advanced Technology for DC-DC Converters 6m V = 10V GS Small Form Factor Thermally Efficient Package Enables Higher 30V 55.6A Density End Products 10m V = 4.5V GS Occupies Just 33% of the Board Area Occupied by SO-8 Enabling Smaller End Product 100% UIS (Avalanche) Rated Lead-Free Finish RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) Mechanical Data Description and Applications Case: PowerDI 3333-8 This MOSFET is designed to minimize the on-state resistance Case Material: Molded Plastic,Gree Molding Compound. (R ), yet maintain superior switching performance, making it DS(ON) UL Flammability Classification Rating 94V-0 ideal for high efficiency power management applications. Moisture Sensitivity: Level 1 per J-STD-020 Terminal Connections Indicator: See Diagram Backlighting Terminal Finish Matte Tin Annealed over Copper Leadframe. Power Management Functions Solderable per MIL-STD-202, Method 208 DC-DC Converters Weight: 0.072 grams (Approximate) PowerDI3333-8 D Pin 1 S S 1 8 S G 7 2 G 6 3 D D 5 4 D S D Equivalent Circuit Top View Top View Bottom View Ordering Information (Note 4) Part Number Case Packaging DMT3006LFG-7 2,000/Tape & Reel PowerDI3333-8 DMT3006LFG-13 3,000/Tape & Reel PowerDI3333-8 Notes: 1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied. 2. See DMT3006LFG Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Drain-Source Voltage V 30 V DSS Gate-Source Voltage V 20 V GSS T = +25C 55.6 C Continuous Drain Current (Note 6) V = 10V I A GS D 44.4 T = +70C C T = +25C 16.0 A A Continuous Drain Current (Note 5) V = 10V I GS D 12.8 T = +70C A Maximum Continuous Body Diode Forward Current (Note 5) I 2 A S Pulsed Drain Current (10s Pulse, Duty Cycle = 1%) I 80 A DM Avalanche Current, L=0.1mH I 25 A AS Avalanche Energy, L=0.1mH E 31 mJ AS Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Total Power Dissipation (Note 6) T = +25C P 27.8 W C D Thermal Resistance, Junction to Case (Note 6) R 4.5 JC C/W Thermal Resistance, Junction to Ambient (Note 5) R 54 JA Operating and Storage Temperature Range T T -55 to +150 C J, STG Electrical Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 7) Drain-Source Breakdown Voltage BV 30 V V = 0V, I = 250A DSS GS D Zero Gate Voltage Drain Current I 1 A V = 24V, V = 0V DSS DS GS V = +20V, V = 0V GS DS Gate-Source Leakage I 100 nA GSS V = -16V, V = 0V GS DS ON CHARACTERISTICS (Note 7) Gate Threshold Voltage 1.0 3.0 V V V = V , I = 250A GS(TH) DS GS D 4.8 6 V = 10V, I = 12A GS D Static Drain-Source On-Resistance R m DS(ON) 6.9 10 V = 4.5V, I = 12A GS D Diode Forward Voltage V 0.7 1.0 V V = 0V, I = 2A SD GS S DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance C 1,155 iss V = 15V, V = 0V, DS GS 456 Output Capacitance C pF oss f = 1.0MHz 72 Reverse Transfer Capacitance C rss Gate Resistance R 1.6 V = 0V, V = 0V, f = 1.0MHz G DS GS 8.4 Total Gate Charge (V = 4.5V) Q GS G 16.7 Total Gate Charge (V = 10V) Q GS G nC V = 15V, I = 9A DD D Gate-Source Charge 2.2 Q GS Gate-Drain Charge 3.5 Q GD Turn-On Delay Time 3.5 t D(ON) 5.5 Turn-On Rise Time t V = 15V, V = 10V, R DD GS ns 13.5 Turn-Off Delay Time t R = 3, I = 9A D(OFF) G D 4.6 Turn-Off Fall Time t F Body Diode Reverse Recovery Time t 19.3 ns RR I = 1.5A, di/dt = 100A/s F 8.6 Body Diode Reverse Recovery Charge Q nC RR Notes: 5. R is determined with the device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate. R is guaranteed by design JA JC while R is determined by the users board design. JA 6. Thermal resistance from junction to soldering point (on the exposed drain pad). 7. Short duration pulse test used to minimize self-heating effect. 8. Guaranteed by design. Not subject to product testing. 2 of 7 DMT3006LFG September 2018 Diodes Incorporated www.diodes.com Document number: DS38252 Rev. 5 - 2

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8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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