DMTH6016LFDFWQ 60V +175C N-CHANNEL ENHANCEMENT MODE MOSFET Product Summary Features I Max Rated to +175CIdeal for High Ambient Temperature D BV R Max DSS DS(ON) T = +25C Environments A 100% Unclamped Inductive Switching (UIS) Test in Production: 18m V = 10V 9.4A GS 60V Ensures More Reliable and Robust End Application 27.5m V = 4.5V 7.6A GS Low R Ensures On-State Losses Are Minimized DS(ON) 0.6mm ProfileIdeal for Low-Profile Applications 2 PCB Footprint of 4mm Sidewall Plated for Improved Optical Inspection Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen- and Antimony-Free. Green Device (Note 3) The DMTH6016LFDFWQ is suitable for automotive applications requiring specific change control this part is AEC-Q101 qualified, PPAP capable, and manufactured in IATF 16949 certified facilities. DMTH6016LFDFWQ Marking Information 66 = Product Type Marking Code YM = Date Code Marking 66 Y = Year (ex: H = 2020) M = Month (ex: 9 = September) Date Code Key Year 2017 2018 2019 2020 2021 2022 2023 2024 Code E F G H I J K L Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Code 1 2 3 4 5 6 7 8 9 O N D Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Drain-Source Voltage V 60 V DSS Gate-Source Voltage V 20 V GSS T = +25C 9.4 A Continuous Drain Current (Note 7) V = 10V I A GS D 6.6 T = +100C A Pulsed Drain Current (10s Pulse, Duty Cycle = 1%) 70 A I DM Continuous Source-Drain Diode Current (Note 7) 3.0 A I S Pulsed Source-Drain Diode Current (10s Pulse, Duty Cycle = 1%) 70 A I SM Avalanche Current, L = 0.1mH I 15.3 A AS Avalanche Energy, L = 0.1mH E 11.7 mJ AS Thermal Characteristics Characteristic Symbol Value Unit Total Power Dissipation (Note 6) 1.06 W T = +25C P A D Thermal Resistance, Junction to Ambient (Note 6) R 141 C/W JA Total Power Dissipation (Note 7) T = +25C P 2.3 W A D Thermal Resistance, Junction to Ambient (Note 7) R 63 C/W JA Thermal Resistance, Junction to Case (Note 7) T = +25C R 9.6 C/W C JC Operating and Storage Temperature Range T T -55 to +175 C J, STG Notes: 6. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout. 7. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate. 2 of 8 January 2021 DMTH6016LFDFWQ www.diodes.com Diodes Incorporated Datasheet number: DS40959 Rev. 4 - 2 ADVANCED INFORMATION YM