DNLS350E-13 Diodes Incorporated

Green DNLS350 E LOW VCE(SAT) NPN TRANSISTOR IN SOT223 Features Mechanical Data BV > 60V Case: SOT223 CEO I = 3.0A High Continuous Current Case Material: Molded Plastic, Green Molding Compound. C Extremely Low Equivalent On-Resistance R 62m at 2A UL Flammability Rating 94V-0 CE(SAT) Complementary PNP Type: DPLS350E Moisture Sensitivity: Level 1 per J-STD-020 Lead-Free Finish RoHS Compliant (Notes 1 & 2) Terminals: Finish Matte Tin Plated Leads. Solderable per Halogen and Antimony Free. Green Device (Note 3) MIL-STD-202, Method 208 Qualified to AEC-Q101 Standards for High Reliability Weight: 0.112 grams (Approximate) Applications Ideal for Medium Power Switching or Amplification Applications SOT223 C E B C C B E Top View Top View Device Symbol Pin-Out Ordering Information (Note 4) Product Compliance Marking Reel Size (inches) Tape Width (mm) Quantity per Reel DNLS350E-13 AEC-Q101 N35 13 12 2,500 Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See DNLS350 E Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage 60 V V CBO Collector-Emitter Voltage 50 V V CEO Emitter-Base Voltage V 6 V EBO Continuous Collector Current I 3 A C Peak Pulse Collector Current I 5 A CM Peak Pulse Base Current I 1 A BM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 5) 3 Power Dissipation (Note 6) P 2 W D (Note 7) 1 (Note 5) 41.7 Thermal Resistance, Junction to Ambient (Note 6) R 62.5 C/W JA (Note 7) 125 Thermal Resistance, Junction to Leads (Note 8) 15 C/W R JL Operating and Storage Temperature Range -55 to +150 C T T J, STG ESD Ratings (Note 9) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge Machine Model ESD MM 400 V C Notes: 5. For a device mounted with the collector lead on 50mm x 50mm 2oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 6. Same as Note (5), except mounted on 25mm x 25mm 2oz copper. 7. Same as Note (5), except mounted on minimum recommended pad (MRP) layout. 8. Thermal resistance from junction to solder-point (at the end of the collector lead). 9. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 8 DNLS350E November 2015 Diodes Incorporated www.diodes.com Document number: DS31231 Rev. 4 - 2