TD TD TD DSS3540M 40V PNP LOW V TRANSISTOR CE(sat) Features Mechanical Data Case: X1-DFN1006-3 BV > -40V CEO Case Material: Molded Plastic,Gree Molding Compound. I = -500mA High Collector Current C UL Flammability Classification Rating 94V-0 I = -1A Peak Pulse Current CM Moisture Sensitivity: Level 1 per J-STD-020 P = 1000mW Power Dissipation D e4 Terminals: Finish NiPdAu Low Collector-Emitter Saturation Voltage, V CE(sat) Solderable per MIL-STD-202, Method 208 2 0.60mm Package Footprint, 13 times Smaller than SOT23 Weight: 0.0009 grams (Approximate) 0.5mm Height Package Minimizing Off-Board Profile Complementary NPN Type DSS2540M Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free.Gree Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability C X1-DFN1006-3 B B C E E Top View Device Schematic Bottom View Device Symbol Ordering Information (Note 4) Product Marking Reel size (inches) Tape width (mm) Quantity per reel DSS3540M-7 TD 7 8 3,000 DSS3540M-7B TD 7 8 10,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See DSS3540M Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage -40 V VCBO Collector-Emitter Voltage -40 V V CEO Emitter-Base Voltage -6 V V EBO Collector Current - Continuous -500 mA I C Peak Pulse Collector Current -1 A I CM Peak Base Current -100 mA I BM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 5) 400 Power Dissipation P mW D (Note 6) 1,000 (Note 5) 310 Thermal Resistance, Junction to Ambient R C/W JA (Note 6) 120 Thermal Resistance, Junction to Lead (Note 7) R 120 C/W JL Operating and Storage and Temperature Range T , T -55 to +150 C J STG ESD Ratings (Note 8) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V B Notes: 5. For the device mounted on minimum recommended pad layout 1oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in steady state condition. The entire exposed collector pad is attached to the heatsink. 6. Same as Note 5, except the exposed collector pad is mounted on 25mm x 25mm 2oz copper. 7. Thermal resistance from junction to solder-point (on the exposed collector pad). 8. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 DSS3540M May 2015 Diodes Incorporated www.diodes.com Document number: DS31821 Rev. 5 - 2