NOT RECOMMENDED FOR NEW DESIGN USE ZXTP5240F DSS5240T 40V PNP LOW SATURATION TRANSISTOR IN SOT23 Features Mechanical Data BV > -40V Case: SOT23 CEO I = -2A High Continuous Collector Current Case Material: Molded Plastic, Green Molding Compound. C I = -3A Peak Pulse Current UL Flammability Classification Rating 94V-0 CM Low Saturation Voltage -225mV Max I = -1A Moisture Sensitivity: Level 1 per J-STD-020 C R = 90m at -0.5A for a Low Equivalent On-Resistance Terminals: FinishMatte Tin Plated Leads, Solderable per CE(SAT) 730mW Power Dissipation MIL-STD-202, Method 208 Complimentary NPN Type: DSS4240T Weight 0.008 grams (Approximate) Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) Application For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/200, PPAP Gate Driving MOSFETs and IGBTs capable, and manufactured in IATF 16949 certified facilities), Load Switch please contact us or your local Diodes representative. DC-DC Converters NOT RECOMMENDED FOR NEW DESIGN USE ZXTP5240F DSS5240T Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V -40 V CBO Collector-Emitter Voltage V -40 V CEO Emitter-Base Voltage V -5 V EBO Peak Pulse Collector Current I -3 A CM Continuous Collector Current I -2 A C Base Current I -300 mA B Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Power Dissipation (Note 6) 730 mW P D Power Dissipation (Note 7) 600 mW P D Thermal Resistance, Junction to Ambient Air (Note 6) R 171 C/W JA Thermal Resistance, Junction to Ambient Air (Note 7) R 209 C/W JA Thermal Resistance, Junction to Lead (Note 8) R 75 C/W JL Operating and Storage Temperature Range T , T -55 to +150 C J STG ESD Ratings (Note 9) Characteristic Symbol Value Unit JEDEC Class Electrostatic DischargeHuman Body Model ESD HBM 4000 V 3A Electrostatic DischargeMachine Model ESD MM 400 V C Notes: 6. For a device mounted with the collector lead on 15mm 15mm 1oz copper that is on a single-sided 1.6mm FR-4 PCB device is measured under still air conditions whilst operating in a steady-state. 7. Same as Note 6, except the device is mounted on minimum recommended pad layout. 8. Thermal resistance from junction to solder-point (at the end of the collector lead). 9. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 June 2021 DSS5240T Diodes Incorporated www.diodes.com Document number: DS31591 Rev. 7 - 3