DSS60601MZ4 60V NPN LOW SATURATION TRANSISTOR IN SOT223 Features Mechanical Data Case: SOT223 BV > 60V CEO I = 6A High Continuous Current Case material: molded plastic. Green molding compound. C I = 12A Peak Pulse Current CM UL Flammability Rating 94V-0 Low Saturation Voltage V < 60mV 1A Moisture Sensitivity: Level 1 per J-STD-020 CE(sat) Complementary PNP Type: DSS60600MZ4 Terminals: Finish - Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2) Weight: 0.115 grams (approximate) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability SOT223 C B E Top View Top View Device Symbol Pin-Out Ordering Information (Note 4) Product Compliance Marking Reel Size (inches) Tape width (mm) Quantity per reel DSS60601MZ4-13 AEC-Q101 ZNS66 13 12 2500 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See DSS60601MZ4 Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V 100 V CBO Collector-Emitter Voltage V 60 V CEO Emitter-Base Voltage V 6 V EBO Continuous Collector Current I 6 A C Peak Pulse Collector Current I 12 A CM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 5) 3 Power Dissipation (Note 6) P 2 W D (Note 7) 1.2 (Note 5) 41.7 Thermal Resistance, Junction to Ambient (Note 6) 62.5 R C/W JA (Note 7) 104 Thermal Resistance, Junction to Leads (Note 8) R 12.9 C/W JL Operating and Storage Temperature Range T T -55 to +150 C J, STG ESD Ratings (Note 9) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. For a device mounted with the collector lead on 50mm x 50mm 2oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in steady-state. 6. Same as note (5), except the device is mounted on 25mm x 25mm 2oz copper. 7. Same as note (5), except the device is mounted on minimum recommended pad (MRP) layout. 8. Thermal resistance from junction to solder-point (at the end of the collector lead). 9. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 8 March 2014 DSS60601MZ4 Diodes Incorporated www.diodes.com Document number: DS31587 Rev. 3 - 2