DXT13003DG 450V NPN HIGH VOLTAGE POWER TRANSISTOR IN SOT223 Features Mechanical Data BV > 450V Case: SOT223 CEO > 700V BV Case Material: Molded Plastic. Green Molding Compound CES BV > 9V UL Flammability Rating 94V-0 EBO I = 1.5A high Continuous Collector Current Moisture Sensitivity: Level 1 per J-STD-020 C Integrated Collector-Emitter Diode to act as free-wheeling diode Terminals: Finish - Matte Tin Plated Leads, Solderable per Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2) MIL-STD-202, Method 208 Halogen and Antimony Free. Green Device (Note 3) Weight: 0.112 grams (approximate) Applications Low power AC-DC SMPS for: Battery Chargers for Mobile Phone / Tablets / Smartphones Power Supply for DVD / STB LED Lighting SOT223 Top View Top View Device Schematic Pin-Out Ordering Information (Note 4) Product Package Marking Tape Width (mm) Quantity DXT13003DG-13 SOT223 DXT13003D 12 2,500 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See DXT13003DG Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit 700 V Collector-Emitter Voltage (V = 0V) V BE CES Collector-Emitter Voltage 450 V V CEO Emitter-Base Voltage 9 V V EBO Continuous Collector Current 1.3 A I C Peak Pulse Collector Current I 3 A CM Continuous Base Current I 0.75 A B Peak Pulse Base Current I 1.5 A BM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 5) 3 Power Dissipation (Note 6) P 2 W D (Note 7) 0.7 (Note 5) R 42 JA Thermal Resistance, Junction to Ambient (Note 6) 62.5 R JA C/W (Note 7) 178 R JA Thermal Resistance Junction to Lead (Note 8) 17 R JL Operating and Storage Temperature Range -55 to +150 T T C J, STG ESD Ratings (Note 9) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 8,000 V 3B Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. For a device mounted with the collector lead on 50mm x 50mm 2oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 6. Same as note (5), except the device is mounted on 25mm x 25mm 2oz copper. 7. Same as note (5), except the device is mounted on minimum recommended pad layout. 8. Thermal resistance from junction to solder-point (at the end of the collector lead). 9. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 6 May 2014 DXT13003DG Diodes Incorporated www.diodes.com Datasheet Number: DS37262 Rev. 1 - 2