DXT13003EK 460V NPN HIGH VOLTAGE POWER TRANSISTOR IN TO252 Features Mechanical Data BV > 460V CEO Case: TO252 (DPAK) BV > 700V CES Case Material: Molded Plastic,Gree Molding Compound BV > 9V EBO UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 I = 1.5A high Continuous Collector Current C Terminals: Finish - Matte Tin Plated Leads Solderable per Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2) MIL-STD-202, Method 208 Halogen and Antimony Free. Green Device (Note 3) Weight: 0.34 grams (approximate) TO252 (DPAK) C B E Top View Top View Device Schematic Pin-Out Ordering Information (Note 4) Product Compliance Marking Reel Size (inches) Tape Width (mm) Quantity per Reel DXT13003EK-13 Standard 13003E 13 16 2,500 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See DXT13003EK Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Emitter Voltage (V = 0V) V 700 V BE CES Collector-Emitter Voltage V 460 V CEO Emitter-Base Voltage 9 V V EBO Continuous Collector Current 1.5 A I C Peak Pulse Collector Current (Note 5) 3 A I CM Continuous Base Current 0.75 A I B Peak Pulse Base Current (Note 5) I 1.5 A BM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 6) 3.9 (Note 7) 2.5 Power Dissipation P W D (Note 8) 2.1 (Note 9) 1.6 (Note 6) 32 (Note 7) 51 Thermal Resistance, Junction to Ambient Air R JA (Note 8) 59 C/W (Note 9) 80 Thermal Resistance, Junction to Leads (Note 10) 3 R JL Operating and Storage Temperature Range -55 to +150 T , T C J STG ESD Ratings (Note 11) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 8,000 V 3B Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. Pulse test for pulse width < 5ms, duty cycle 10%. 6. For a device mounted with the exposed collector pad on 50mm x 50mm 2oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 7. Same as note (6), except the device is surface mounted on 25mm x 25mm 2oz copper. 8. Same as note (6), except the device is surface mounted on 25mm x 25mm 1oz copper. 9. Same as note (6), except mounted on minimum recommended pad (MRP) layout. 10. Thermal resistance from junction to solder-point (on the exposed collector pad). 11. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 May 2014 DXT13003EK Diodes Incorporated www.diodes.com Datasheet Number: DS37296 Rev.1 - 2